US2013136905A1PendingUtilityA1

Manufacturing method of deco glass panel and glass panel using the same

Assignee: LG ELECTRONICS INCPriority: Nov 30, 2011Filed: Nov 29, 2012Published: May 30, 2013
Est. expiryNov 30, 2031(~5.3 yrs left)· nominal 20-yr term from priority
B44C 5/0407C03C 2218/365B44C 3/02C03C 3/066B41M 3/006Y10T428/24926C03C 2218/34C03C 17/04C03C 2218/17C03C 17/34Y10T428/24851B44C 1/10C03C 2217/72B44F 7/00C03C 8/04B44C 5/04
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Claims

Abstract

A method of manufacturing a deco glass panel, and a deco glass panel using the same. The method includes a pattern forming step of applying an adhesive onto a mother substrate of a glass panel in a prescribed pattern; applying glass powder onto the surface of the mother substrate of the glass panel having the adhesive applied thereonto; hardening the adhesive applied onto the glass panel by heating the glass panel in a state where the glass powder has been applied; heating the glass panel at a temperature lower than a melting point of the glass powder; welding the glass panel at a temperature higher than a melting point of the glass powder but lower than a melting point of the mother substrate of the glass panel; cooling the glass panel; and attaching a prescribed rear surface pattern on a rear surface of the glass panel.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method of manufacturing a deco glass panel, the method comprising:
 forming a pattern by applying an adhesive onto a front surface of a mother substrate of the glass panel in a prescribed pattern;   applying glass powder onto the surface of the mother substrate having the adhesive applied thereonto;   hardening the adhesive applied onto the mother substrate by heating the glass panel in a state where the glass powder has been applied;   preheating the glass panel at a temperature lower than a melting point of the glass powder;   welding the glass powder to the glass panel at a temperature higher than a melting point of the glass powder but lower than a melting point of the mother substrate;   cooling the glass panel; and   attaching a rear surface pattern on a rear surface of the mother substrate.   
     
     
         2 . The method of  claim 1 , wherein the rear surface pattern is formed by directly applying a pattern or a design onto a rear surface of the mother substrate. 
     
     
         3 . The method of  claim 1 , wherein the rear surface pattern is formed by attaching a film onto a rear surface of the mother substrate, the film having a pattern attached thereto. 
     
     
         4 . The method of  claim 1 , wherein the rear surface pattern is located within an outline of the glass powder when viewed from a front surface of the glass panel. 
     
     
         5 . The method of  claim 4 , wherein the rear surface pattern has a width narrower than that of a glass powder on the front surface of the mother substrate. 
     
     
         6 . The method of  claim 1 , wherein during the preheating, the glass panel is heated at 440-460° C. for 60-75 seconds. 
     
     
         7 . The method of  claim 1 , wherein during the welding, the glass panel is heated at 630-715° C. for 60-75 seconds. 
     
     
         8 . The method of  claim 1 , wherein the hardening of the adhesive comprises:
 heating the glass panel to a first temperature; and then   heating the glass panel to a second temperature lower than the first temperature.   
     
     
         9 . The method of  claim 8 , wherein the first temperature is within a range of 240-260° C., and the second temperature is within a range of 170-190° C. 
     
     
         10 . The method of  claim 1 , wherein the pattern forming comprises:
 preparing a mesh blocked except for prescribed patterns;   placing the prepared mesh on the mother substrate of the glass panel;   applying an adhesive onto the mesh; and   removing the mesh.   
     
     
         11 . The method of  claim 1 , further comprising:
 preparing glass powder by heating a non-lead glass plate and then rapidly cooling the non-lead glass plate.   
     
     
         12 . The method of  claim 1 , wherein the glass powder has an average diameter of 0.2-0.35 mm. 
     
     
         13 . The method of  claim 1 , wherein the cooling comprises:
 cooling the glass panel by spraying water or air onto the surface of the glass panel; and then   cooling the glass panel to room temperature by placing the glass panel in air.   
     
     
         14 . A deco glass panel, comprising:
 a mother substrate formed of glass;   a glass powder layer welded on the mother substrate; and   a rear surface pattern disposed on a rear surface of the mother substrate,   wherein the rear surface pattern is located within an outline of the glass powder layer when viewed from the front surface of the mother substrate.   
     
     
         15 . The deco glass panel of  claim 14 , wherein the glass powder comprises, by weight, 11-20% SiO 2 , 30-35% ZnO, 15-20% B 2 O 3 , 10-18% NaO 2 , 1-5% Al 2 O 3 , 1-4% ZrO 2 , 1-4% CaO, and other impurities. 
     
     
         16 . The deco glass panel of  claim 15 , wherein the glass powder further comprises, by weight, 0.05-0.25% Fe 2 O 3  and 0.001-0.004% MnO. 
     
     
         17 . The deco glass panel of  claim 14 , wherein a film layer is additionally provided on a rear surface of the rear surface pattern. 
     
     
         18 . A deco glass panel, comprising:
 a mother substrate formed of glass;   a glass powder layer welded on the mother substrate; and   a film disposed on a rear surface of the mother substrate,   wherein the film has a prescribed surface pattern with a different color from a ground color of the film and the rear surface pattern has the same shape of the glass powder layer.   
     
     
         19 . The deco glass panel of  claim 18 , wherein the prescribed surface pattern is formed to be within an outline of the glass powder layer when viewed from an upper surface of the mother substrate. 
     
     
         20 . The deco glass panel of  claim 18 , wherein the glass powder comprises, by weight, 11-20% SiO 2 , 30-35% ZnO, 15-20% B 2 O 3 , 10-18% NaO 2 , 1-5% Al 2 O 3 , 1-4% ZrO 2 , 1-4% CaO, 0.05-0.25% Fe 2 O 3  and 0.001-0.004% MnO and other impurities.

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