Solid state led bridge rectifier light engine

Abstract

A method of forming a light emitting diode (LED) for a solid state light engine includes depositing a layer of tacky resin onto a die portion of the LED, adhering a plurality of phosphor particles to the tacky resin, and encapsulating the layer of tacky resin and the plurality of phosphor particles in another layer of resin.

1 . A method of forming a light emitting diode (LED) for a solid state light engine, the method comprising:
 depositing a layer of tacky resin onto a die portion of the LED;   adhering a plurality of phosphor particles to the tacky resin; and   encapsulating the layer of tacky resin and the plurality of phosphor particles in another layer of resin.   
     
     
         2 . The method of  claim 1 , further comprising: curing the layer of tacky resin. 
     
     
         3 . A method of forming a light emitting diode (LED) for a solid state light engine, the method comprising:
 depositing a layer of tacky resin onto a die portion of the LED; and   encapsulating the layer of tacky resin in another layer of resin and dispersing a plurality of phosphor particles in the encapsulant.   
     
     
         4 . The method of  claim 3 , further comprising: curing the layer of tacky resin. 
     
     
         5 . A method of forming a light emitting diode (LED) for a solid state light engine, the method comprising:
 depositing a layer of tacky resin onto a die portion of the LED;   encapsulating the layer of tacky resin in another layer of resin; and   applying a plurality of phosphor particles to an outer surface of the encapsulant.   
     
     
         6 . The method of  claim 5 , further comprising: curing the layer of tacky resin. 
     
     
         7 . A method of forming a light emitting diode (LED) for a solid state light engine, the method comprising:
 depositing a layer of tacky resin onto a die portion of the LED; and   applying a plurality of phosphor particles according to at least one of the following: adhering a plurality of phosphor particles to the tacky resin and encapsulating the layer of tacky resin and the plurality of phosphor particles in another layer of resin; encapsulating the layer of tacky resin in another layer of resin and dispersing a plurality of phosphor particles in the encapsulant; and, encapsulating the layer of tacky resin in another layer of resin and applying a plurality of phosphor particles to an outer surface of the encapsulant.