Post cmp scrubbing of substrates

Abstract

A cleaning method is provided for brush cleaning a surface of a substrate. The method comprises scrubbing a first surface of the substrate with a brush having a first surface geometry; and then scrubbing the first surface of the substrate with a brush having a second surface geometry, wherein the first and the second surface geometries are different. Numerous other aspects are provided.

The invention claimed is: 
     
         1 . A method of cleaning a substrate comprising:
 scrubbing a first surface of the substrate with a brush having a first surface geometry; and simultaneously scrubbing a second surface of the substrate with a brush having a second surface geometry, wherein the first and the second surface geometries are different.   
     
     
         2 . The method of  claim 1 , wherein the first surface geometry is profiled and the second surface geometry is smooth. 
     
     
         3 . The method of  claim 1 , wherein the first surface geometry is smooth and the second surface geometry is profiled. 
     
     
         4 . The method of  claim 1 , wherein scrubbing with the brush having the smooth surface geometry comprises:
 trapping a cleaning fluid between the first surface of the substrate and the brush having the smooth surface geometry.