Cooling system for electronic device

Abstract

A cooling system for cooling an electronic device includes a heat exchanger, a first refrigerant pipe, a pump, a second refrigerant pipe, and a cooling apparatus. The heat exchanger, the first refrigerant pipe, the pump, and the second refrigerant pipe are connected in that order to form a first circulation system. The cooling apparatus is connected between the pump and the second refrigerant pipe. The cooling apparatus is exposed outside the electronic device. When the temperature outside the electronic device is higher than the temperature in the electronic device, the first circulation system cools the electronic device. When the temperature outside the electronic device is lower than the temperature in the electronic device, the refrigerant flows through the cooling apparatus to be cooled.

What is claimed is: 
     
         1 . A cooling system for an electronic device, comprising:
 a heat exchanger arranged in the electronic device for cooling the electronic device;   a first refrigerant pipe;   a pump;   a second refrigerant pipe, wherein the first and second refrigerant pipes receive refrigerants, which can circulate in the heat exchanger;   a first valve;   a second valve; and   a cooling apparatus located outside the electronic device;   wherein the heat exchanger, the first refrigerant pipe, the pump, the first valve, and the second refrigerant pipe are connected in that order to form a first circulation system and circulate refrigerants; the heat exchanger, the first refrigerant pipe, the pump, the second valve, the cooling apparatus, and the second refrigerant pipe are connected in that order to form a second circulation system and circulate refrigerants; and   wherein when the first valve is opened and the second valve is closed, the refrigerant is circulated in the first circulation system, to dissipate heat for the electronic device, when the first valve is closed and the second valve is opened, the refrigerant is circulated in the second circulation system, the refrigerant flows through the cooling apparatus and is cooled by the cooling apparatus.   
     
     
         2 . The cooling system of  claim 1 , wherein the cooling apparatus comprises a metal pipe in a snake-like pattern. 
     
     
         3 . The cooling system of  claim 1 , wherein the heat exchanger is an air conditioner. 
     
     
         4 . A cooling system for an electronic device, comprising:
 a heat exchanger arranged in the electronic device for cooling the electronic device;   a first refrigerant pipe;   a pump;   a second refrigerant pipe, wherein the first and second refrigerant pipes receive refrigerants, which can circulate in the heat exchanger, the heat exchanger, the first refrigerant pipe, the pump, and the second refrigerant pipe are connected in that order to form a first circulation system and circulate refrigerants; and   a cooling apparatus connected between the pump and the second refrigerant pipe and located outside the electronic device;   Wherein when the temperature outside the electronic device is higher than the temperature in the electronic device, the first circulation system cools the electronic device, when the temperature outside the electronic device is lower than the temperature in the electronic device, the refrigerant flows through the cooling apparatus to be cooled.   
     
     
         5 . The cooling system of  claim 4 , wherein the cooling apparatus comprises a metal pipe in a snake-like pattern. 
     
     
         6 . The cooling system of  claim 4 , wherein the heat exchanger is an air conditioner. 
     
     
         7 . The cooling system of  claim 4 , wherein a switch apparatus is connected to the pump, the switch apparatus is operated to control the refrigerant to flow through the cooling apparatus. 
     
     
         8 . The cooling system of  claim 7 , wherein the switch apparatus comprises a first valve and a second valve, the first valve is connected between the pump and the second refrigerant pipe, the second valve is connected between the pump and the cooling apparatus. 
     
     
         9 . The cooling system of  claim 8 , wherein when the first valve is opened and the second valve is closed, the refrigerant is circulated in the first circulation system, to dissipate heat for the electronic device, when the first valve is closed and the second valve is opened, the refrigerant flows through the cooling apparatus and is cooled by the cooling apparatus.