Systems and methods for providing a system-on-a-substrate

Abstract

This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e.g., a processor, memory, accelerometers, I/O circuitry, or any other suitable components) can be fabricated on a single microchip in “bare die” form. The die can, for example, be coupled to suitable flash memory through a substrate and flexible printed circuit board (“flex”). In some embodiments, the flex can extend past the substrate, die, or both, to allow additional, relatively large components to be coupled to the flex. In some embodiments, the die can be coupled to the flash memory through the flex and without a substrate. In some embodiments, component test points can be placed on the flash memory side of the substrate.

We claim: 
     
         1 . A system comprising:
 a substrate;   a microchip comprising a plurality of components of the system, wherein the microchip is electrically coupled to a first surface of the substrate;   a flexible printed circuit board (“flex”), wherein a first surface of the flex is electrically coupled to a second surface of the substrate; and   an entity, wherein the entity is electrically coupled to a second surface of the flex, and wherein the flex and the substrate electrically couple the microchip to the entity.   
     
     
         2 . The system of  claim 1 , wherein the entity is a flash memory. 
     
     
         3 . The system of  claim 2 , wherein the flash memory is a NAND gate-based flash memory. 
     
     
         4 . The system of  claim 1 , wherein the entity is a discrete component not comprised in the microchip. 
     
     
         5 . The system of  claim 1 , further comprising:
 a ledge extending from the flex; and   a large component coupled to the ledge.   
     
     
         6 . The system of  claim 5 , wherein the large component is large in size relative to the microchip. 
     
     
         7 . The system of  claim 5 , wherein the ledge is vertically offset from the flex. 
     
     
         8 . The system of  claim 5 , wherein the ledge is vertically aligned with the flex. 
     
     
         9 . The system of  claim 5 , wherein the large component comprises a capacitor. 
     
     
         10 . The system of  claim 1 , further comprising at least one test point, wherein the test point is operable to test the quality of at least one component of the plurality of components. 
     
     
         11 . The system of  claim 10 , wherein the at least on test point is positioned in the flex. 
     
     
         12 . The system of  claim 11 , wherein the at least one test point is positioned in a location that is substantially below the at least one component. 
     
     
         13 . A system comprising:
 a microchip comprising each component of the system, wherein each component is fabricated in bare die form in the microchip;   a flexible printed circuit board (“flex”), wherein the microchip is electrically coupled to the flex; and   a memory device, wherein the memory device is electrically coupled to the flex, and wherein the flex provides routing to electrically couple the memory device to the microchip.   
     
     
         14 . The system of  claim 13 , wherein at least one component of the system comprises one of a processor, a memory, CODEC circuitry, input/output circuitry, communication circuitry, an accelerometer, a capacitor, and an inductor. 
     
     
         15 . The system of  claim 13 , further comprising a substrate, wherein the microchip is coupled to a surface of the substrate, wherein the flex is coupled to a surface of the substrate, and wherein the microchip is electrically coupled to the flex through routing provided by the substrate. 
     
     
         16 . The system of  claim 15 , wherein the microchip and the flex are coupled to the same surface of the substrate. 
     
     
         17 . The system of  claim 15 , wherein the microchip and the flex are coupled to different surfaces of the substrate.