Electronic Component Structure and Electronic Device

Abstract

According to one embodiment, an electronic component structure includes an electronic component, an electrode, and a restriction portion. The electrode is connected to the electronic component in a multilayer state and comprises a plurality of solder regions on a side opposite to a side of the electronic component. Each of the solder regions is soldered to a substrate by separate solders. The restriction portion is connected to a periphery of the solder regions, and has a level difference relative to the solder regions.

What is claimed is: 
     
         1 . An electronic component structure comprising:
 an electronic component; and   an electrode comprising a lead frame and a plated layer, the lead frame being connected to the electronic component electrically and comprising a concave, the plated layer covering the lead frame on a first side of the lead frame opposite a second side of the lead frame at which the electronic component is disposed, the plated layer being soldered to a substrate, wherein   the electrode comprises a restriction portion in which the concave is covered with the plated layer, and   the restriction portion is configured to prevent solder soldering the plated layer to the substrate from entering the concave.   
     
     
         2 . The electronic component structure of  claim 1 , further comprising
 a connection layer between the electronic component and the lead frame.   
     
     
         3 . The electronic component structure of  claim 2 , wherein the restriction portion is formed in a lattice. 
     
     
         4 . The electronic component structure of  claim 2 , wherein the connection layer is exposed to a bottom surface of the restriction portion. 
     
     
         5 . The electronic component structure of  claim 1 , further comprising a connection layer on a first side of the lead frame opposite a second side of the lead frame at which the plated layer is disposed. 
     
     
         6 . The electronic component structure of  claim 5 , wherein the connection layer is exposed to a bottom surface of the restriction portion. 
     
     
         7 . The electronic component structure of  claim 6 , wherein the restriction portion is formed in a lattice. 
     
     
         8 . An electronic component structure comprising:
 an electronic component; and   an electrode comprising a lead frame and a plated layer, the lead frame being electrically coupled to the electronic component and comprising a restriction portion, the plated layer covering the lead frame on a first side of the lead frame opposite a second side of the lead frame at which the electronic component is disposed, the plated layer being soldered to a substrate at one or more solder regions,   wherein the restriction portion is configured to prevent solder soldering the plated layer to the substrate from entering from a first solder region of the one or more solder regions into a second solder region of the one or more solder regions.   
     
     
         9 . The electronic component structure of  claim 8 , further comprising
 a connection layer between the electronic component and the lead frame.   
     
     
         10 . The electronic component structure of  claim 9 , wherein the restriction portion is formed in a lattice. 
     
     
         11 . The electronic component structure of  claim 9 , wherein the connection layer is exposed to a bottom surface of the restriction portion. 
     
     
         12 . The electronic component structure of  claim 8 , further comprising a connection layer on a first side of the lead frame opposite a second side of the lead frame at which the plated layer is disposed. 
     
     
         13 . The electronic component structure of  claim 12 , wherein the connection layer is exposed to a bottom surface of the restriction portion. 
     
     
         14 . The electronic component structure of  claim 13 , wherein the restriction portion is formed in a lattice.