Light emitting device and fabricating method thereof

Abstract

A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light.

What is claimed is: 
     
         1 . A fabricating method of a light emitting device, comprising:
 disposing at least one light emitting chip on a surface of a substrate;   forming at least one tubular structure on the surface of the substrate and surrounding the at least one light emitting chip; and   disposing at least one fluorescent conversion layer in the at least one tubular structure and covering the at least one light emitting chip.   
     
     
         2 . The fabricating method of a light emitting device as claimed in  claim 1 , wherein the at least one tubular structure is formed by photolithography process, laser writing process, mold pressing, etching, or injection molding. 
     
     
         3 . The fabricating method of a light emitting device as claimed in  claim 1 , wherein a material of the at least one tubular structure is provided for light rays emitted by the at least one light emitting chip and light rays excited from the at least one fluorescent conversion layer to pass through. 
     
     
         4 . The fabricating method of a light emitting device as claimed in  claim 3 , wherein the material of the at least one tubular structure is silica gel, a mixture of silica gel and silica, resin, or glass. 
     
     
         5 . The fabricating method of a light emitting device as claimed in  claim 4 , wherein after the step of disposing at least one fluorescent conversion layer in the at least one tubular structure, the method further comprises disposing a microlens on the surface and surrounding the at least one tubular structure. 
     
     
         6 . The fabricating method of a light emitting device as claimed in  claim 5 , wherein after the step of disposing at least one fluorescent conversion layer in the at least one tubular structure and covering the at least one light emitting chip, the method further comprises disposing a package carrier for carrying the substrate. 
     
     
         7 . The fabricating method of a light emitting device as claimed in  claim 1 , wherein an angle and a space are formed between an outer tube wall of the at least one tubular structure and the surface of the substrate. 
     
     
         8 . The fabricating method of a light emitting device as claimed in  claim 7 , wherein the angle is acute. 
     
     
         9 . The fabricating method of a light emitting device as claimed in  claim 7 , wherein an inner tube wall and an outer tube wall of the tubular structure are non-parallel. 
     
     
         10 . The fabricating method of a light emitting device as claimed in  claim 7 , wherein an inner tube wall is vertical to the surface of the substrate. 
     
     
         11 . The fabricating method of a light emitting device as claimed in  claim 1 , wherein the at least one tubular structure is transparent. 
     
     
         12 . The fabricating method of a light emitting device as claimed in  claim 1 , wherein a ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. 
     
     
         13 . The fabricating method of a light emitting device as claimed in  claim 12 , wherein a ratio of the maximal vertical thickness and the maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 1.5 and 4. 
     
     
         14 . A tubular structure adapted to be implemented in a light emitting device comprising a substrate and a light emitting chip, the tubular structure and the light emitting chip being formed on an surface of the substrate, wherein a first space surrounded by the tubular structure allows the light emitting chip to be disposed in, an angle and a second space are formed between an outer tube wall of the tubular structure and the surface. 
     
     
         15 . The tubular structure according to  claim 14 , wherein the angle is acute. 
     
     
         16 . The tubular structure according to  claim 14 , wherein the outer tube wall and an inner tube wall of the tubular structure are non-parallel. 
     
     
         17 . The tubular structure according to  claim 14 , wherein an inner tube wall of the tubular structure is vertical to the surface. 
     
     
         18 . A fabricating method of the tubular structure according to  claim 14  comprising:
 forming the tubular structure by a photolithography process, a laser writing process, a mold pressing, an etching manner, or an injection molding.