Method for producing an electronic module by sequential fixation of the components

Abstract

An electronic module includes a board with a printed circuit, at least one component of a first type soldered to the board, and at least one component of a second type. The component of the second type extends above the at least one component of the first type. The at least one component of the first type is placed at least partially between the at least one component of the second type and the board and the at least one component of the second type includes a plurality of pads soldered to the board.

1 .- 8 . (canceled) 
     
     
         9 . An electronic module comprising:
 a board with a printed circuit,   at least one component of a first type soldered to the board, and   at least one component of a second type extending above the at least one component of the first type, the at least one component of the first type being placed at least partially between the at least one component of the second type and the board, and the at least one component of the second type having a plurality of pads soldered to the board.   
     
     
         10 . The electronic module as claimed in  claim 9 , wherein the at least one component of the second type is soldered by applying two electrodes to each of the plurality of pads and by running an electrical current between the electrodes to heat each of the plurality of pads of the at least one component of the second type.