Apparatus for plating cylinder

Abstract

Provided is a plating apparatus for a cylinder, which is capable of extending service life of the entire apparatus in a technology of plating a cylinder, eliminating hardness nonuniformity of a plating layer on a cylinder surface by achieving a uniform hardness, and suppressing oxidation of a tip of chuck means. The plating apparatus for a cylinder includes: a plating bath to be filled with a plating solution; chuck means for holding a long cylinder at both ends in a longitudinal direction so as to be rotated and energized, and accommodating the long cylinder in the plating bath; and a pair of opposed insoluble electrodes which is vertically installed so as to face both side surfaces of the long cylinder in the plating bath, and is supplied with a predetermined current. The chuck means includes thermal cooling means, and the thermal cooling means includes a cooling medium and causes the cooling medium to circulate to cool a cylinder holding section of the chuck means so that heat accumulation in the long cylinder, in particular, a cylinder end portion and the cylinder holding section of the chuck means is eliminated.

1 . A plating apparatus for a cylinder, comprising:
 a plating bath to be filled with a plating solution;   chuck means for holding a long cylinder at both ends in a longitudinal direction so as to be rotated and energized, and accommodating the long cylinder in the plating bath; and   a pair of opposed insoluble electrodes which is vertically installed so as to face both side surfaces of the long cylinder in the plating bath, and is supplied with a predetermined current, the pair of opposed insoluble electrodes being brought close to both the side surfaces of the long cylinder with a predetermined interval to perform plating on an outer peripheral surface of the long cylinder, wherein the chuck means comprises thermal cooling means, and the thermal cooling means comprises a cooling medium and causes the cooling medium to circulate to cool a cylinder holding section of the chuck means so that heat accumulation in the long cylinder, in particular, a cylinder end portion and the cylinder holding section of the chuck means is eliminated.   
     
     
         2 . A plating apparatus for a cylinder according to  claim 1 , wherein the thermal cooling means comprises:
 a main pipe portion provided adjacent to the cylinder holding section of the chuck means;   a cooling medium flow path formed in the main pipe portion, for distributing the cooling medium;   an external flow path provided in communication with an inflow port and an outflow port of the cooling medium flow path;   a cooling medium sealed in the cooling medium flow path and the external flow path;   circulation pump means which is installed in the external flow path and functions so that the cooling medium sealed in the cooling medium flow path and the external flow path flows into the cooling medium flow path from the external flow path through the inflow port and flows out to the external flow path from the cooling medium flow path through the outflow port; and   a cooling device which is installed in the external flow path and functions to cool the cooling medium flowing out of the outflow port.   
     
     
         3 . A plating apparatus for a cylinder according to  claim 1 , wherein the plating solution is a copper plating solution or a chromium plating solution, and the long cylinder is a hollow cylindrical gravure cylinder. 
     
     
         4 . A plating apparatus for a cylinder according to  claim 2 , wherein the plating solution is a copper plating solution or a chromium plating solution, and the long cylinder is a hollow cylindrical gravure cylinder.