Printed circuit boards and methods of manufacturing printed circuit boards

Abstract

A printed circuit board includes a substrate having a first surface, a first conductive circuit deposited on the first surface and a dielectric cover deposited on the first surface and covering at least a portion of the first conductive circuit. The dielectric cover has an edge and the first surface is exposed beyond the edge. A second conductive circuit is deposited on the dielectric cover and the substrate. The second conductive circuit spans the edge such that at least part of the second conductive circuit is deposited on the dielectric cover and at least part of the second conductive circuit is deposited on the first surface.

What is claimed is: 
     
         1 . A printed circuit board comprising:
 a substrate having a first surface;   a first conductive circuit deposited on the first surface;   a dielectric cover deposited on the first surface and covering at least a portion of the first conductive circuit, the dielectric cover having an edge, the first surface being exposed beyond the edge; and   a second conductive circuit deposited on the dielectric cover and the substrate, the second conductive circuit spanning the edge such that at least part of the second conductive circuit is deposited on the dielectric cover and at least part of the second conductive circuit is deposited on the first surface.   
     
     
         2 . The printed circuit board of  claim 1 , wherein the second conductive circuit is deposited on and is electrically connected to the first conductive circuit. 
     
     
         3 . The printed circuit board of  claim 1 , wherein the second conductive circuit bridges over the first conductive circuit with the dielectric cover positioned between the first and second conductive circuits to electrically isolate the second conductive circuit from the first conductive circuit. 
     
     
         4 . The printed circuit board of  claim 1 , wherein the dielectric cover is only slightly wider than the first conductive circuit, a majority of the substrate being uncovered by the dielectric cover. 
     
     
         5 . The printed circuit board of  claim 1 , wherein the dielectric cover is a bump extending from the first surface over the first conductive circuit, the bump having a curved transition from the edge toward the center of a dielectric cover. 
     
     
         6 . The printed circuit board of  claim 1 , wherein the dielectric cover has an inner surface and an outer surface, the inner surface being deposited on and directly engaging the first surface and the first conductive circuit, the second conductive circuit being deposited on and directly engaging the outer surface of the dielectric cover. 
     
     
         7 . The printed circuit board of  claim 1 , wherein the dielectric cover includes a via, at least a portion of the first conductive circuit being exposed in the via, the edge peripherally surrounding the via, the second conductive circuit extending into the via and engaging the first conductive circuit in the via. 
     
     
         8 . The printed circuit board of  claim 1 , wherein the first and second conductive circuits each include a printed conductive trace and a conductive circuit trace, the printed conductive trace being pad printed, the conductive circuit trace being electroplated to the printed conductive trace. 
     
     
         9 . The printed circuit board of  claim 1 , wherein the dielectric cover is pad printed on the first surface. 
     
     
         10 . The printed circuit board of  claim 1 , further comprising a third conductive circuit deposited on the first surface of the substrate, the dielectric cover covering at least a portion of the third conductive circuit, the first conductive circuit being discontinuous and having first and second ends located on opposite sides of the third conductive circuit, the second conductive circuit crossing over the third conductive circuit and being electrically connected to the first conductive circuit proximate to the first and second ends, the second conductive circuit being electrically isolated from the third conductive circuit by the dielectric cover. 
     
     
         11 . The printed circuit board of  claim 1 , wherein the second conductive circuit is non-planer with a first segment of the second conductive circuit being deposited on the first surface and being generally planer and a second segment of the second conductive circuit being deposited on the dielectric cover and transitioning along a curved surface of the dielectric cover. 
     
     
         12 . A method of manufacturing a printed circuit board, the method comprising:
 depositing a first conductive circuit on a substrate;   depositing a dielectric cover on the substrate and at least part of the first conductive circuit; and   depositing a second conductive circuit such that at least part of the second conductive circuit is deposited on the dielectric cover and at least part of the second conductive circuit is deposited on the substrate.   
     
     
         13 . The method of  claim 12 , wherein the depositing a first conductive circuit comprises printing a printed conductive trace on the substrate and electroplating the printed conductive trace to define a conductive circuit trace having a higher current carrying capacity than the printed conductive trace. 
     
     
         14 . The method of  claim 12 , wherein the deposing a second conductive circuit comprises:
 printing a printed conductive trace on the substrate across the interface between the substrate and the dielectric cover and on the dielectric cover; and   electroplating the printed conductive trace to define a conductive circuit trace having a higher current carrying capacity than the printed conductive trace, the conductive circuit trace spanning the interface between the substrate and the dielectric cover.   
     
     
         15 . The method of  claim 12 , wherein the depositing a dielectric cover comprises printing dielectric material onto the substrate in select areas such that portions of the substrate are exposed beyond the dielectric cover. 
     
     
         16 . The method of  claim 12 , wherein the depositing a second conductive circuit comprises depositing a second conductive circuit such that the second conductive circuit is directly electrically connected to the first conductive circuit. 
     
     
         17 . The method of  claim 12 , wherein the depositing a second conductive circuit comprises depositing a second conductive circuit such that the second conductive circuit is electrically isolated from the first conductive circuit by the dielectric cover. 
     
     
         18 . The method of  claim 12 , wherein the depositing a dielectric cover comprises depositing a dielectric cover on the substrate such that the dielectric cover has a smooth, curved transition from the substrate toward a center of the dielectric cover. 
     
     
         19 . The method of  claim 12 , wherein the depositing a dielectric cover comprises depositing a dielectric cover on the substrate such that a via is peripherally surrounded by the dielectric cover, the first conductive circuit being exposed in the via, the depositing a second conductive circuit comprises depositing a second conductive circuit on the dielectric cover such that the second conductive circuit transitions into the via, the second conductive circuit being electrically connected to the first conductive circuit in the via. 
     
     
         20 . A method of manufacturing a printed circuit board, the method comprising:
 providing a substrate having a base wall and a side wall extending from the base wall, the base wall and the side wall meeting at a corner, the base wall and the side wall defining a non-planar surface spanning the corner;   printing a conductive circuit on the non-planar surface, the conductive circuit spanning the corner such that at least part of the conductive circuit is on the base wall and at least part of the conductive circuit is on the side wall.   
     
     
         21 . The method of  claim 20 , wherein the base wall and the side wall are external walls of a case configured to hold electronic components therein. 
     
     
         22 . The method of  claim 20 , wherein the base wall and the side wall have inner surfaces and outer surfaces, the inner surfaces defining a cavity to hold electronic components therein, the method comprising printing a conductive circuit on at least one of the inner surfaces and the outer surfaces of the base wall and the side wall. 
     
     
         23 . The method of  claim 20 , wherein the corner defines an exterior corner, the method comprises printing a conductive circuit on the exterior corner. 
     
     
         24 . The method of  claim 20 , wherein the printing comprises pad printing a printed conductive trace, the method further comprising plating the printed conductive trace to define a conductive circuit trace having a higher current carrying capacity than the printed conductive trace. 
     
     
         25 . The method of  claim 20 , wherein the providing a substrate comprises depositing a dielectric cover on the base wall to define the side wall.