Substrate plating apparatus and substrate plating control method

Abstract

Disclosed herein is a substrate plating apparatus, including: a constant current device supplying power; cathode hangers that includes a plurality of clamps holding substrates, hall current sensors mounted on each of the clamps to detect current information, and wireless communication modules connected with the hall current sensors to wirelessly transmit the current information to the outside; a current rail mounted with the plurality of cathode hangers above a plating bath and connected with the constant current device; and an anode unit extending from the constant current device and dipped in a plating solution of the plating bath.

What is claimed is: 
     
         1 . A substrate plating apparatus, comprising:
 a constant current device supplying power;   cathode hangers that includes a plurality of clamps holding substrates, hall current sensors mounted on each of the clamps to detect current information, and wireless communication modules connected with the hall current sensors to wirelessly transmit the current information to the outside;   a current rail mounted with the plurality of cathode hangers above a plating bath and connected with the constant current device; and   an anode unit extending from the constant current device and dipped in a plating solution of the plating bath.   
     
     
         2 . The substrate plating apparatus as set forth in  claim 1 , wherein the cathode hanger includes:
 a horizontal support and a suspending support slidably supported to the current rail;   a feeding unit disposed above the horizontal support;   a conduction base coupled with the feeding unit;   a rail guide provided below the suspending support; and   a variable slide disposed on the rail guide,   wherein the plurality of clamps fixing the substrates are mounted on the variable slide.   
     
     
         3 . The substrate plating apparatus as set forth in  claim 2 , wherein the wireless communication module is mounted at one side of the suspending support. 
     
     
         4 . The substrate plating apparatus as set forth in  claim 1 , wherein the wireless communication module uses a local area wireless communication scheme of any one of zigbee, blue tooth, radio frequency identification (RFID), and WiFi. 
     
     
         5 . The substrate plating apparatus as set forth in  claim 1 , wherein the wireless communication module includes:
 a wireless communication processing unit connected with the hall current sensor to receive current information on each of the clamps and converting the current information into information in a local area wireless communication scheme; and   a local area wireless transceiver wirelessly transmitting the converted current information to the outside.   
     
     
         6 . The substrate plating apparatus as set forth in  claim 1 , wherein the hall current sensor is provided using a ring type hall device surrounding one side of the clamp. 
     
     
         7 . A substrate plating control method, comprising:
 mounting a substrate to be plated using a plurality of clamps mounted on hangers;   detecting current information flowing in each of the clamps by using wireless communication modules mounted on the hangers and hall current sensor mounted of each of the clamps;   determining, by an external control unit, whether the current information wirelessly received in real time from the wireless communication module satisfies preset current reference information for good plating; and   if it is determined that the current information satisfies the current reference information, processing, by the control unit, the substrate mounted on the corresponding hanger or the clamp as a substrate having a good plating film.   
     
     
         8 . The subs ate plating control method as set forth in  claim 7 , wherein the mounting of the substrate includes:
 mounting the substrates to be engaged between conduction contacts of the clamps; and   applying current through the clamp in a state in which the substrate is dipped in a plating solution.   
     
     
         9 . The substrate plating control method as set forth in  claim 7 , wherein the detecting of the current information in real time includes:
 detecting, by the hall current sensor, the current applied to each of the clamps in real time and transferring the detected current to the wireless communication module;   wirelessly transmitting, by the wireless communication module, the current information to the control unit; and   displaying, by the control unit, the current information by an accumulated average current value summing real time current values or average current values for each of the hangers or the clamps.   
     
     
         10 . The substrate plating control method as set forth in  claim 7 , wherein at the determining, the current reference information includes an applied current range, a current deviation range, and a current density range. 
     
     
         11 . The substrate plating control method as set forth in  claim 7 , wherein the wireless communication module wirelessly transmits the current information by a local area wireless communication scheme of any one of zigbee, blue tooth, radio frequency identification (RFID), and WiFi. 
     
     
         12 . The substrate plating control method as set forth in  claim 7 , wherein the hall current sensor detects the current applied to the clamp in real time by using a ring type hall device surrounding one side of the clamp.