Composite alloy bonding wire

Abstract

A manufacturing method for a composite alloy bonding wire and products thereof are provided. A primary material of Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain an Ag—Pd alloy solution. The obtained Ag—Pd alloy solution is drawn to obtain an Ag—Pd alloy wire. The Ag—Pd alloy wire is then drawn to obtain an Ag—Pd alloy bonding wire with a predetermined diameter.

What is claimed is: 
     
         1 . A composite alloy bonding wire, comprising:
 90.00˜99.99 wt. % Ag; and   0.01˜10.00 wt. % but not more than 10.00 wt. % Pd, besides unavoidable impurities, wherein the Ag and Pd are melted to obtain a Ag—Pd alloy that excludes Mg and Al, and Ag and Pd are essentially uniformly distributed in the alloy bonding wire, continuous casting and drawing processes are performed on the Ag—Pd alloy to obtain the alloy bonding wire used for packaging processes for IC, LED or SAW, and the composite alloy bonding wire has slender grains and annealing twins.   
     
     
         2 . The composite alloy bonding wire according to  claim 1 , wherein the amount of the annealing twins to all grains is above 20%.