Vacuum sealing process of a mems package

Abstract

A vacuum sealing process of a micro-electrical-mechanical-system (MEMS) package is provided. Solder is applied to the rimmed bottom of a lid for the package. A micro-electro-mechanical system (MEMS) device is attached to a substrate for the package. Solder is applied to a lipped top of the substrate. The lid and the substrate are sealed in an elevated temperature and vacuum environment.

1 : A method to vacuum seal a micro-electro-mechanical system (MEMS) package, comprising:
 applying a solder to a bottom of a lid for the package;   attaching a MEMS device to a substrate for the package;   applying the solder to a top of the substrate;   aligning the lid and the substrate by fitting the bottom of the lid around the top of the substrate;   applying pressure to the lid against the substrate; and   sealing the lid and the substrate at elevated temperature and under vacuum.   
     
     
         2 : The method of  claim 1 , wherein the bottom of the lid comprises a rimmed bottom. 
     
     
         3 : The method of  claim 2 , wherein applying a solder to a bottom of a lid for the package comprises applying the solder to lower and side surfaces of the rimmed bottom. 
     
     
         4 : The method of  claim 1 , wherein the top of the substrate comprises a metal rectangular ring. 
     
     
         5 : The method of  claim 4 , wherein applying the solder to a top of the substrate comprises applying the solder onto the metal rectangular ring. 
     
     
         6 : The method of  claim 1 , wherein the bottom of the lid comprises a rimless bottom. 
     
     
         7 : The method of  claim 6 , wherein applying a solder to a bottom of a lid for the package comprises applying the solder to lower and side surfaces of the rimless bottom. 
     
     
         8 : The method of  claim 1 , wherein the top of the substrate comprises a lipped top. 
     
     
         9 : The method of  claim 8 , wherein applying the solder to a top of the substrate comprises applying the solder to top and side surfaces of the lipped top. 
     
     
         10 : The method of  claim 1 , further comprising:
 applying a flux to the bottom of the lid.   
     
     
         11 : The method of  claim 10 , further comprising:
 applying the flux to the top of the substrate.   
     
     
         12 : The method of  claim 1 , wherein the solder includes a flux. 
     
     
         13 : The method of  claim 1 , wherein sealing the lid and the substrate at elevated temperature and under vacuum comprises heating the package at 265° C. under 1 Torr. 
     
     
         14 : The method of  claim 13 , wherein sealing the lid and the substrate at elevated temperature and under vacuum further comprises vibrating the package. 
     
     
         15 : The method of  claim 1 , further comprising wire bonding the MEMS device and the substrate.