Heat dissipating apparatus

Abstract

A heat dissipating apparatus includes a base, a first fin assembly, a second fin assembly, a first heat pipe, and a second heat pipe. The first fin assembly and the second fin assembly are disposed on the top surface of the base. The first fin assembly defines a first through hole. The second fin assembly defines a second through hole. The second fin assembly is a structural mirror image of the first fin assembly. The first heat pipe includes a first contacting portion in contact with the base and a second contacting portion received in the first through hole of the first fin assembly. The second heat pipe includes a third contacting portion in contact with the base and a fourth contacting portion received in the second through hole of the second fin assembly.

What is claimed is: 
     
         1 . A heat dissipating apparatus, comprising:
 a base comprising a top surface and a bottom surface configured for contacting an electronic heat-generating component;   a first fin assembly and a second fin assembly disposed on the top surface of the base, wherein the first fin assembly defines a first through hole, the second fin assembly defines a second through hole, and the second fin assembly is a structural mirror image of the first fin assembly;   a first heat pipe comprising a first contacting portion in contact with the base and a second contacting portion received in the first through hole of the first fin assembly; and   a second heat pipe comprising a third contacting portion in contact with the base and a fourth contacting portion received in the second through hole of the second fin assembly.   
     
     
         2 . The heat dissipating apparatus of  claim 1 , wherein the first heat pipe further comprises a first connecting portion interconnecting the first contacting portion and the second contacting portion, and the second heat pipe further comprises a second connecting portion interconnecting the third contacting portion and the fourth contacting portion. 
     
     
         3 . The heat dissipating apparatus of  claim 2 , wherein the first heat pipe and the second heat pipe are U-shaped. 
     
     
         4 . The heat dissipating apparatus of  claim 1 , wherein the first heat pipe is located in a first plane inclined upward from the top surface of the base, and the second heat pipe is located in a second plane inclined upward from the top surface of the base. 
     
     
         5 . The heat dissipating apparatus of  claim 4 , wherein the first plane and the second plane intersect at the top surface of the base. 
     
     
         6 . The heat dissipating apparatus of  claim 1 , wherein the first heat pipe and the second heat pipe have a same structure. 
     
     
         7 . The heat dissipating apparatus of  claim 1 , wherein a first receiving groove and a second receiving groove are defined in the top surface of the base, the first contacting portion of the first heat pipe is received in the first receiving groove, and the third contacting portion of the second heat pipe is received in the second receiving groove. 
     
     
         8 . The heat dissipating apparatus of  claim 7 , wherein a first cutout groove is defined in a lower surface of the first fin assembly, the first receiving groove together with the first cutout groove define a first receiving hole, and the first contacting portion of the first heat pipe is received in the first receiving hole. 
     
     
         9 . The heat dissipating apparatus of  claim 7 , wherein a second cutout groove is defined in a lower surface of the second fin assembly, the second receiving groove together with the second cutout groove define a second receiving hole, and the third contacting portion of the second heat pipe is received in the second receiving hole. 
     
     
         10 . The heat dissipating apparatus of  claim 7 , wherein the first receiving groove and the second receiving groove are parallel to each other. 
     
     
         11 . The heat dissipating apparatus of  claim 7 , wherein the first receiving groove and the second receiving groove extend lengthwise along the base. 
     
     
         12 . The heat dissipating apparatus of  claim 1 , wherein the first through hole extends along a longer dimension of the first fin assembly, and the second through hole extends along a longer dimension of the second fin assembly. 
     
     
         13 . The heat dissipating apparatus of  claim 1 , wherein a first side surface of the first fin assembly is attached to a second side surface of the second fin assembly. 
     
     
         14 . The heat dissipating apparatus of  claim 10 , wherein the first receiving groove and the second receiving groove are arranged in a middle of the top surface of the base. 
     
     
         15 . The heat dissipating apparatus of  claim 1 , wherein the first fin assembly and the second fin assembly comprise a plurality of parallel fins, and extending directions of the first through hole and the second through hole are perpendicular to the plurality of parallel fins. 
     
     
         16 . The heat dissipating apparatus of  claim 2 , wherein the first connecting portion of the first heat pipe is opposite to the second connecting portion of the second heat pipe.