Heat-dissipating device

Abstract

A heat-dissipating device includes a base and a heat pipe. One side of the base is provided with an accommodating trough for accommodating the heat pipe. The heat pipe has a first heat-absorbing section, a second heat-absorbing section, a third heat-absorbing section provided between the first heat-absorbing section and the second heat-absorbing section, a first heat transfer section, and a second heat transfer section. The first, second and third heat-absorbing sections conduct the heat to the first and second heat transfer sections, and thus the heat-dissipating effect of the present invention is improved greatly.

What is claimed is: 
     
         1 . A heat-dissipating device, including:
 a base having an accommodating trough, the accommodating trough being provided on one side of the base; and   a heat pipe received in the accommodating trough, the heat pipe having a first heat-absorbing section, a second heat-absorbing section, a third heat-absorbing section, a first heat transfer section, and a second heat transfer section, the third heat-absorbing section being provided between the first heat-absorbing section and the second heat-absorbing section, the first heat transfer section being bent outwardly from one end of the first heat-absorbing section and extending to one end of the third heat-absorbing section adjacent to the other end of the first heat-absorbing section, the second heat transfer section being bent outwardly from the other end of the third heat-absorbing section and extending to one end of the second heat-absorbing section adjacent to one end of the third heat-absorbing section.   
     
     
         2 . The heat-dissipating device according to  claim 1 , wherein the first heat-absorbing section, the second heat-absorbing section and the third heat-absorbing section together define a heat-absorbing portion, the first heat transfer section and the second heat transfer section define a heat transfer portion. 
     
     
         3 . The heat-dissipating device according to  claim 2 , wherein the base is further provided with a hole, the hole is provided on the other side of the base and in communication with the accommodating trough. 
     
     
         4 . The heat-dissipating device according to  claim 3 , wherein a heat-conducting piece is received in the hole, one side of the heat-conducting piece is adhered to one side of the heat-absorbing portion, the other side of the heat-conducting piece is adhered to a heat-generating element. 
     
     
         5 . The heat-dissipating device according to  claim 2  wherein the accommodating trough is a through trough from one side of the base to the other side of the base, one side and the other side of the heat pipe are in flush with one side and the other side of the base respectively. 
     
     
         6 . The heat-dissipating device according to  claim 2 , wherein the base is connected to a cover, the cover is provided with a first side and a second side opposite to the first side, the first side is adhered to one side of the base to close the heat pipe. 
     
     
         7 . The heat-dissipating device according to  claim 6 , wherein the cover is provided with a plurality of heat-dissipating fins extending axially from the second side. 
     
     
         8 . The heat-dissipating device according to  claim 4 , wherein one side of the base is connected to a heat-dissipating unit, the heat-dissipating unit is a heat sink or heat-dissipating fin set having a plurality of heat-dissipating fins. 
     
     
         9 . The heat-dissipating device according to  claim 2 , wherein the other side of the base is connected to a heat-dissipating unit, the heat-dissipating unit is a heat sink or heat-dissipating fin set having a plurality of heat-dissipating fins. 
     
     
         10 . The heat-dissipating device according to  claim 5 , wherein the other side of the base is connected to a heat-dissipating unit, the heat-dissipating unit is a heat sink or heat-dissipating fin set having a plurality of heat-dissipating fins. 
     
     
         11 . The heat-dissipating device according to  claim 1 , wherein the first heat-absorbing section, the second heat-absorbing section, the third heat-absorbing section, the first heat transfer section, and the second heat transfer section together form the heat pipe. 
     
     
         12 . The heat-dissipating device according to  claim 2 , wherein the accommodating trough is provided with an open side and a closed side, the open side and the closed side together define the accommodating trough. 
     
     
         13 . The heat-dissipating device according to  claim 11 , wherein the heat-absorbing portion has a first side surface and a second side surface, the heat transfer portion has a third side surface and a fourth side surface opposite to the third side surface, the second side surface and the fourth side surface are adhered to the closed side. 
     
     
         14 . The heat-dissipating device according to  claim 12 , wherein the second side surface and the fourth side surface enclose a D-shaped cross section, the shape of the closed side corresponds to the shape of the combination of the second side surface and the fourth side surface. 
     
     
         15 . The heat-dissipating device according to  claim 1 , wherein the heat pipe is formed into a “8” shape or “S” shape. 
     
     
         16 . The heat-dissipating device according to  claim 1 , wherein the shape of the accommodating trough corresponds to the shape of the heat pipe. 
     
     
         17 . The heat-dissipating device according to  claim 1 , wherein the heat pipe is received in the accommodating trough by any one of tight-fitting, welding, wedging and gluing.