Aqueous polyimide precursor solution composition and method for producing aqueous polyimide precursor solution composition

Abstract

A method for producing an aqueous polyimide precursor solution composition, including reacting a tetracarboxylic dianhydride and a diamine, which has a solubility in water at 25° C. of 0.1 g/L or more, in the presence of an imidazole, using water as a reaction solvent to provide an aqueous polyimide precursor solution composition.

1 . A method for producing an aqueous polyimide precursor solution composition, comprising reacting a tetracarboxylic dianhydride and a diamine, which has a solubility in water at 25° C. of 0.1 g/L or more, in the presence of an imidazole using water as a reaction solvent to provide an aqueous polyimide precursor solution composition. 
     
     
         2 . The method for producing an aqueous polyimide precursor solution composition as claimed in  claim 1 , wherein the amount of the imidazole is 1.6 mole or more per mole of the tetracarboxylic dianhydride. 
     
     
         3 . The method for producing an aqueous polyimide precursor solution composition as claimed in  claim 1 , wherein the imidazole has two or more alkyl groups as substituents. 
     
     
         4 . The method for producing an aqueous polyimide precursor solution composition as claimed in  claim 3 , wherein the imidazole is selected from the group consisting of 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 4-ethyl-2-methylimidazole, and 1-methyl-4-ethylimidazole. 
     
     
         5 . The method for producing an aqueous polyimide precursor solution composition as claimed in  claim 1 , wherein the polyimide precursor has an inherent viscosity of 0.2 or more. 
     
     
         6 . An aqueous polyimide precursor solution composition, wherein
 a polyamic acid formed by the reaction of a tetracarboxylic dianhydride and a diamine, which has a solubility in water at 25° C. of 0.1 g/L or more, is dissolved in an aqueous solvent together with an imidazole, and   the aqueous polyimide precursor solution composition has an organic solvent content of less than 5%.   
     
     
         7 . The aqueous polyimide precursor solution composition as claimed in  claim 6 , wherein the aqueous polyimide precursor solution composition contains substantially no organic solvent. 
     
     
         8 . An aqueous polyimide precursor solution composition, wherein
 a polyamic acid, which is formed by the reaction of a tetracarboxylic acid component and a diamine component, and consists of a repeating unit represented by the following formula (1), is dissolved in an aqueous solvent together with an imidazole having two or more alkyl groups as substituents in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid.   
       
         
           
           
               
               
           
         
       
       wherein A represents a tetravalent group of an aromatic tetracarboxylic acid having two to three aromatic rings, from which carboxyl groups have been removed, and B represents a divalent group of an aromatic diamine having one to two aromatic rings and having a solubility in water at 25° C. of 0.1 g/L or more, from which amino groups have been removed. 
     
     
         9 . The aqueous polyimide precursor solution composition as claimed in  claim 8 , wherein the “A” group in the formula (1) is any one or more of the groups represented by the following formulas (2) to (7). 
       
         
           
           
               
               
           
         
       
     
     
         10 . The aqueous polyimide precursor solution composition as claimed in  claim 8 , wherein the “B” group in the formula (1) is any one or more of the groups represented by the following formulas (8) to (9). 
       
         
           
           
               
               
           
         
       
     
     
         11 . The aqueous polyimide precursor solution composition as claimed in  claim 8 , wherein the aqueous polyimide precursor solution composition has an organic solvent content of less than 5%. 
     
     
         12 . A method for producing an aromatic polyimide seamless belt, comprising:
 heating an aqueous polyimide precursor solution composition, in which a polyamic acid, which is formed by the reaction of a tetracarboxylic acid component and a diamine component, and consists of a repeating unit represented by the following formula (1), is dissolved in an aqueous solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid.   
       
         
           
           
               
               
           
         
       
       wherein A represents a tetravalent group of an aromatic tetracarboxylic acid, from which carboxyl groups have been removed, and B represents a divalent group of an aromatic diamine having a solubility in water at 25° C. of 0.1 g/L or more, from which amino groups have been removed. 
     
     
         13 . A binder resin composition for electrodes, wherein
 a polyamic acid, which is formed by the reaction of a tetracarboxylic acid component and a diamine component, and consists of a repeating unit represented by the following formula (1), is dissolved in an aqueous solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid.   
       
         
           
           
               
               
           
         
       
       wherein A represents a tetravalent group of an aromatic tetracarboxylic acid, from which carboxyl groups have been removed, and B represents a divalent group of an aromatic diamine having a solubility in water at 25° C. of 0.1 g/L or more, from which amino groups have been removed. 
     
     
         14 . An electrode mixture paste comprising an electrode active material and a binder resin composition for electrodes as claimed in  claim 13 . 
     
     
         15 . An electrode produced by applying an electrode mixture paste as claimed in  claim 14  onto a current collector, and then heating the electrode mixture paste to remove a solvent and effect imidization. 
     
     
         16 . A polyimide precursor resin composition for flexible device substrates, wherein
 a polyamic acid, which is formed by the reaction of a tetracarboxylic acid component and a diamine component, and consists of a repeating unit represented by the following formula (1), is dissolved in an aqueous solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid.   
       
         
           
           
               
               
           
         
       
       wherein A represents a tetravalent group of an aromatic tetracarboxylic acid, from which carboxyl groups have been removed, and B represents a divalent group of an aromatic diamine having a solubility in water at 25° C. of 0.1 g/L or more, from which amino groups have been removed. 
     
     
         17 . A method for producing a flexible device which is a display device or a light-receiving device, comprising:
 applying a polyimide precursor resin composition for flexible device substrates as claimed in  claim 16  onto a carrier substrate, and then heating the composition to form a solid polyimide resin film;   forming a circuit on the polyimide resin film; and   separating the polyimide resin film on which the circuit is formed from the carrier substrate.   
     
     
         18 . A flexible device produced by a method for producing a flexible device as claimed in  claim 17 , wherein the flexible device is a display device or a light-receiving device.