Masks for use in applying protective coatings to electronic assemblies, masked electronic assemblies and associated methods

Abstract

One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resulting electronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed.

What is claimed: 
     
         1 . A method for coating an electronic device, comprising:
 assembling a plurality of components of an electronic device to form an electronic assembly;   applying a mask to the electronic assembly, the mask shielding at least a portion of the assembly;   applying a protective coating to at least two components of the electronic assembly with the mask in place; and   removing the mask from the electronic assembly, the protective coating remaining on coated portions of the electronic assembly, uncoated portions of the electronic assembly being exposed through the mask.   
     
     
         2 . The method of  claim 1 , wherein assembling the plurality of components comprises assembling a plurality of components to be located at least partially within an interior of the electronic device. 
     
     
         3 . The method of  claim 1 , further comprising:
 assembling at least one exterior component of the electronic device with the electronic assembly, the at least one exterior component defining at least a portion of an interior of the electronic device, at least a portion of the protective coating and at least a portion of the electronic assembly located within the interior of the electronic device.   
     
     
         4 . The method of  claim 1 , further comprising:
 applying a sealing agent to the at least a portion of the electronic assembly before applying the mask to the electronic assembly, the sealing agent defining a seal between the mask and the electronic assembly upon applying the mask to the electronic assembly.   
     
     
         5 . The method of  claim 1 , wherein applying the mask comprises assembling a preformed mask with the electronic assembly. 
     
     
         6 . The method of  claim 5 , wherein removing the mask comprises disassembling the preformed mask from the electronic assembly. 
     
     
         7 . The method of  claim 6 , further comprising:
 cleaning the preformed mask after disassembling the mask from the electronic assembly.   
     
     
         8 . The method of  claim 6 , further comprising:
 assembling the preformed mask with another electronic assembly.   
     
     
         9 . The method of  claim 6 , wherein assembling the preformed mask with the electronic assembly comprises assembling a mask that depresses at least one button of the electronic device with the electronic device. 
     
     
         10 . The method of  claim 5 , wherein assembling the preformed mask comprises assembling a heat shrink mask with the electronic assembly, then heating the heat shrink mask. 
     
     
         11 . The method of  claim 1 , wherein applying the mask comprises applying a masking material to the electronic assembly and defining the mask from the masking material. 
     
     
         12 . The method of  claim 11 , wherein applying the mask comprises applying a radiation curable masking material to the electronic assembly and exposing at least a portion of the radiation curable masking material to radiation that will cure the radiation curable masking material. 
     
     
         13 . The method of  claim 12 , wherein applying comprises applying the radiation curable material to selected portions of the electronic assembly. 
     
     
         14 . The method of  claim 12 , wherein exposing comprises exposing selected portions of the radiation curable masking material to the radiation. 
     
     
         15 . The method of  claim 11 , wherein removing the mask comprises mechanically removing the mask from the electronic assembly. 
     
     
         16 . The method of  claim 15 , wherein removing the mask comprises chemically removing the mask from the electronic assembly, the chemically removing being effected without removing the protective coating. 
     
     
         17 . The method of  claim 15 , wherein removing the mask comprises radiation processed-removing the mask from the electronic assembly, the radiation processed-removing being effected without removing the protective coating. 
     
     
         18 . The method of  claim 1 , wherein applying the mask includes applying the mask over at least one electrical contact, a light emission element, an imaging element or a sensor of the electronic assembly and, upon removing the mask, the at least one electrical contact, the light emission element, the imaging element or the sensor is exposed through the protective coating. 
     
     
         19 . The method of  claim 1 , further comprising:
 after removing the mask, assembling at least one additional component with the electronic assembly;   applying another mask to the electronic assembly to shield at least a portion of the at least one additional component;   applying another protective coating over the another mask and to at least a portion of the at least one additional component exposed through the another mask; and   removing the another mask from the electronic assembly, the another protective coating remaining on a coated portion of the additional component, at least one uncoated portion of the electronic assembly being exposed through the another mask.   
     
     
         20 . An electronic assembly, comprising:
 an electronic assembly including a plurality of assembled components of an electronic device; and   a mask over a portion of the electronic assembly.   
     
     
         21 . The electronic assembly of  claim 20 , wherein the mask comprises an apparatus removably assembled with the electronic assembly. 
     
     
         22 . The electronic assembly of  claim 21 , further comprising:
 at least one seal between the mask and the electronic assembly.   
     
     
         23 . The electronic assembly of  claim 20 , wherein the mask comprises a coating on the electronic assembly. 
     
     
         24 . The electronic assembly of  claim 20 , further comprising:
 a protective coating on the mask and at least one portion of the electronic assembly exposed through the mask.   
     
     
         25 . A mask configured for assembly with an electronic assembly, comprising at least one preformed element configured for assembly with and disassembly from an electronic assembly, the at least one preformed element configured to shield at least a portion of the electronic assembly, at least one aperture defined through the preformed element to expose another portion of the electronic assembly, and at least one protruding element configured to depress at least one button of the electronic assembly while the at least one preformed element is in an assembled relationship with the electronic assembly. 
     
     
         26 . The mask of  claim 25 , comprising a plurality of preformed elements. 
     
     
         27 . The mask of  claim 26 , wherein the plurality of preformed elements are configured for assembly with one another.