Heat-dissipating substrate for led

Abstract

The present invention relates to a heat-dissipating substrate for LED, comprising a polyimide film, a copper foil or a copper alloy foil which is laminated on one side of the polyimide film, and an aluminum foil or an aluminum alloy foil which is laminated on the other side of the polyimide film, in which the thermal resistance between the surface of the copper foil or the copper alloy foil and the surface of the aluminum foil or the aluminum alloy foil is 1.8° C./W or less.

1 - 7 . (canceled) 
     
     
         8 . A heat-dissipating substrate for LED, comprising
 a polyimide film,   a copper foil or a copper alloy foil, which is laminated on one side of the polyimide film, and   an aluminum foil or an aluminum alloy foil, which is laminated on the other side of the polyimide film;   wherein the thermal resistance between the surface of the copper foil or the copper alloy foil and the surface of the aluminum foil or the aluminum alloy foil is 1.8° C./W or less.   
     
     
         9 . A heat-dissipating substrate for LED as claimed in  claim 8 , wherein the aluminum foil or the aluminum alloy foil is not subjected to anodization treatment (alumite treatment). 
     
     
         10 . A heat-dissipating substrate for LED as claimed in  claim 8 , wherein the polyimide film has a thickness of from 3 μm to 25 μm. 
     
     
         11 . A heat-dissipating substrate for LED as claimed in  claim 8 , wherein a surface of the polyimide film to be bonded to the copper foil or the copper alloy foil, and a surface of the polyimide film to be bonded to the aluminum foil or the aluminum alloy foil comprise a thermo-compression bondable polyimide layer. 
     
     
         12 . A heat-dissipating substrate for LED as claimed in  claim 11 , wherein the polyimide film comprises a heat-resistant polyimide layer, and thermo-compression bondable polyimide layers, which are laminated on both sides of the heat-resistant polyimide layer. 
     
     
         13 . A heat-dissipating substrate for LED as claimed in  claim 8 , wherein the copper foil or the copper alloy foil has a thickness of from 9 μm to 200 μm, and the aluminum foil or the aluminum alloy foil has a thickness of from 200 μm to 1 mm. 
     
     
         14 . A heat-dissipating substrate for LED as claimed in  claim 8 , wherein the polyimide film, the copper foil or the copper alloy foil, and the aluminum foil or the aluminum alloy foil are bonded together using a hot-press forming machine.