Package structure for semiconductor light emitting device

Abstract

A package structure for a semiconductor light emitting device is provided. The package structure includes a semiconductor light emitting device, a lead frame, an electrostatic discharge protection device and an encapsulation. The lead frame supports the semiconductor light emitting device, and has a gap. The electrostatic discharge protection device is fastened in the gap and electrically connected to the lead frame. The encapsulation covers the lead frame, the semiconductor light emitting device and the electrostatic discharge protection device.

What is claimed is: 
     
         1 . A package structure for a semiconductor light emitting device, comprising:
 a semiconductor light emitting device;   a lead frame supporting the semiconductor light emitting device, wherein the lead frame has a gap;   an electrostatic discharge protection device fastened in the gap and electrically connected to the lead frame; and   an encapsulation covering the lead frame, the semiconductor light emitting device and the electrostatic discharge protection device.   
     
     
         2 . The package structure for the semiconductor light emitting device according to  claim 1 , further comprising a plurality of wires through which the semiconductor light emitting device and the lead frame are electrically connected. 
     
     
         3 . The package structure for the semiconductor light emitting device according to  claim 1 , wherein the semiconductor light emitting device is a light emitting diode. 
     
     
         4 . The package structure for the semiconductor light emitting device according to  claim 1 , wherein the electrostatic discharge protection device is a Zener diode. 
     
     
         5 . The package structure for the semiconductor light emitting device according to  claim 1 , wherein the electrostatic discharge protection device is fastened in the gap by a conductive adhesive. 
     
     
         6 . A package structure for a semiconductor light emitting device, comprising:
 a semiconductor light emitting device;   a lead frame supporting the semiconductor light emitting device and comprising an anode lead frame and a cathode lead frame;   an electrostatic discharge protection device disposed between the anode lead frame and the cathode lead frame and electrically connected to the anode lead frame and the cathode lead frame; and   an encapsulation covering the lead frame, the semiconductor light emitting device and the electrostatic discharge protection device.   
     
     
         7 . The package structure for the semiconductor light emitting device according to  claim 6 , wherein the electrostatic discharge protection device comprising a P-type semiconductor layer and an N-type semiconductor layer, the P-type semiconductor layer contacts the cathode lead frame, and the N-type semiconductor layer contacts the anode lead frame. 
     
     
         8 . The package structure for the semiconductor light emitting device according to  claim 6 , further comprising a plurality of wires through which the semiconductor light emitting device and the lead frame are electrically connected. 
     
     
         9 . The package structure for the semiconductor light emitting device according to  claim 6 , wherein the semiconductor light emitting device a light emitting diode. 
     
     
         10 . The package structure for the semiconductor light emitting device according to  claim 6 , wherein the electrostatic discharge protection device is a Zener diode. 
     
     
         11 . The package structure for the semiconductor light emitting device according to  claim 6 , wherein the electrostatic discharge protection device is fastened between the anode lead frame and the cathode lead frame by a conductive adhesive. 
     
     
         12 . A package structure for a semiconductor light emitting device, comprising:
 a plurality of semiconductor light emitting devices;   a lead frame having a plurality of supporting bases respectively supporting the semiconductor light emitting devices, wherein the lead frame has a plurality of gaps, each gap being disposed between two neighboring supporting bases;   a plurality of electrostatic discharge protection devices respectively fastened in the gaps and electrically connected to the lead frame; and   an encapsulation covering the lead frame, the semiconductor light emitting devices and the electrostatic discharge protection devices.   
     
     
         13 . The package structure for the semiconductor light emitting device according to  claim 12 , further comprising a plurality of wires through which the semiconductor light emitting devices and the lead frame are electrically connected. 
     
     
         14 . The package structure for the semiconductor light emitting device according to  claim 12 , wherein the semiconductor light emitting devices are light emitting diodes. 
     
     
         15 . The package structure for the semiconductor light emitting device according to  claim 12 , wherein the electrostatic discharge protection devices are Zener diodes. 
     
     
         16 . The package structure for the semiconductor light emitting device according to  claim 12 , wherein the electrostatic discharge protection devices are fastened in the gaps by a conductive adhesive respectively.