Light-emitting diode device

Abstract

An encapsulated light-emitting diode device is disclosed. The encapsulated light-emitting diode device includes a circuit carrier including a surface; a light-emitting device including a transparent substrate, the transparent substrate including a first surface and a second surface; a light-emitting diode chip located on the first surface of the transparent substrate; and a first transparent glue covering the light-emitting diode chip and formed on the first surface; wherein the first surface and the surface comprise an included angle larger than zero; wherein the first transparent glue has a circular projection on the first surface and the light-emitting diode chip is substantially located at the center of the circular projection.

What is claimed is: 
     
         1 . An encapsulated light-emitting diode device, comprising:
 a circuit carrier, comprising a surface; and   a light-emitting device, comprising:
 a transparent substrate, comprising a first surface and a second surface; 
 a light-emitting diode chip located on the first surface of the transparent substrate; and 
 a first transparent glue covering the light-emitting diode chip and formed on the first surface; 
   wherein the first surface and the surface comprise an included angle larger than zero;   wherein the first transparent glue has a substantially circular projection on the first surface and the light-emitting diode chip is substantially located at the geometry center of the circular projection.   
     
     
         2 . The encapsulated light-emitting device as claimed in  claim 1 , wherein the included angle is between 45 degrees to 135 degrees. 
     
     
         3 . The encapsulated light-emitting device as claimed in  claim 1 , further comprising a second transparent glue formed on the second surface corresponding to the first transparent glue. 
     
     
         4 . The encapsulated light-emitting device as claimed in  claim 1 , further comprising a fixing glue forming on the first surface and surrounding the periphery of the first transparent glue. 
     
     
         5 . The encapsulated light-emitting device as claimed in  claim 4 , wherein the fixing glue is a reflective white glue. 
     
     
         6 . The encapsulated light-emitting device as claimed in  claim 4 , wherein the circuit carrier is a printed circuit board (PCB), a flexible circuit board (FCB), a ceramic substrate, or a composite substrate. 
     
     
         7 . The encapsulated light-emitting device as claimed in  claim 1 , further comprising a phosphor layer covering the light-emitting diode chip. 
     
     
         8 . The encapsulated light-emitting device as claimed in  claim 1 , wherein the first transparent glue has phosphor particles therein or thereon. 
     
     
         9 . The encapsulated light-emitting device as claimed in  claim 1 , further comprising an adhesive layer adhering the transparent substrate to the platform. 
     
     
         10 . The encapsulated light-emitting device as claimed in  claim 1 , wherein the material of the first transparent glue comprises polyimide, BCB, PFCB, SU8, epoxy, Acrylic Resin, COC, PMMA, PET, PC, polyetherimide, fluorocarbon polymer, SOG, or other transparent organic material. 
     
     
         11 . The encapsulated light-emitting device as claimed in  claim 1 , the light-emitting diode chip further comprises a front light extraction surface substantially perpendicular to the surface.