Method of making a circuit interrupting device

Abstract

A circuit interrupting device is manufacturable in a number of different configurations providing current path options, conductor connectivity options and sensing options. The device may include a configurable solid insulation housing into which various operable components are installed. The device may include a core element including a sensor assembly and conductor members, from which the various configurations may be established including a plurality of different current path configurations. A plurality of circuit interrupting devices may be configured together in an assembly with corresponding disconnect assemblies. An interlock is provided to prevent operation of the disconnect assemblies unless the circuit interrupting devices are in an open state.

We claim: 
     
         1 . A method of providing a circuit interrupting device, the method comprising:
 providing a plurality of mold sections, each mold section including a mold portion defining a portion of a housing, the mold sections being joinable into a mold for molding a housing;   selecting from the plurality of mold sections a portion of the plurality of mold sections, the selected portion of mold sections being determined by a predetermined configuration for a housing for the circuit interrupting device, the configuration of the housing being determined by a current path for the circuit interrupting device;   joining the selected portion of the mold sections for form a mold;   forming the housing using the mold; and   disposing within the housing a first conductor, a second conductor and a fault interrupter coupling the first conductor and the second conductor to define the current path.   
     
     
         2 . The method of  claim 1 , wherein a mold section of the plurality of mold sections corresponds to a common housing feature. 
     
     
         3 . The method of  claim 1 , comprising providing a core assembly, and molding the core assembly within the solid insulating housing. 
     
     
         4 . The method of  claim 3 , wherein the core assembly comprises a sensor. 
     
     
         5 . The method of  claim 3 , wherein the core assembly comprises the first and second conductors. 
     
     
         6 . The method of  claim 1 , wherein the current path comprises a “Z” or “N” shape. 
     
     
         7 . The method of  claim 1 , wherein the current path comprises a “C” or “U” shape.