Wafer Processing Equipment

Abstract

A wafer processing equipment, for use in operations of cutting and grinding wafers, comprises a driving device and at least one processing wheel. The driving device has a spindle extending therefrom, which can be fitted with a locking member. The processing wheel is coupled to the spindle of the driving device. The processing wheel defines a through hole at a center thereof, whereby the spindle of the driving device can be inserted through the through hole of the processing wheel to be fitted with the locking member, so that the processing wheel can be securely coupled to the spindle. The processing wheel can be selected to be a cutting wheel or a grinding wheel. As such, only one set of wafer processing equipment is adequate in performing both of cutting and grinding operations, thereby reducing the working space required for processing wafers and lowering the manufacturing cost.

I claim: 
     
         1 . A wafer processing equipment for use in operations of cutting and grinding wafers, which comprises:
 a driving device adapted to be mounted on a preset working machine, said driving device having a spindle extending therefrom, which can be fitted with a locking member; and   at least one processing wheel coupled to said spindle of said driving device, wherein said processing wheel defines a through hole at a center thereof, whereby said spindle of said driving device can be inserted through said through hole of said processing wheel to be fitted with said locking member, so that said processing wheel can be securely coupled to said spindle.   
     
     
         2 . The wafer processing equipment of  claim 1 , wherein said processing wheel is selected to be a cutting wheel. 
     
     
         3 . The wafer processing equipment of  claim 1 , wherein said processing wheel is selected to be a grinding wheel. 
     
     
         4 . The wafer processing equipment of  claim 1 , which further comprises a clamping mechanism fitted around said spindle, said clamping mechanism including a first clamping disk, a second clamping disk, and a covering disk, wherein said spindle of said driving device is sequentially inserted through said first clamping disk, said processing wheel, said second clamping disk, and said covering disk, so that said processing wheel is located between said first clamping disk and said second clamping disk, and wherein said locking member is fitted to said spindle to have said clamping mechanism and said processing wheel securely coupled to said spindle. 
     
     
         5 . The wafer processing equipment of  claim 4 , wherein said first clamping disk is provided with a raised portion corresponding to said through hole of said processing wheel and defines a through hole on said raised portion, whereby said spindle of said driving device can be inserted through said through hole of said raised portion, whereas said raised portion of said first clamping disk can be inserted into said through hole of said processing wheel. 
     
     
         6 . The wafer processing equipment of  claim 4 , wherein said second clamping disk defines a through hole, whereby said spindle of said driving device can be inserted through said through hole of said second clamping disk. 
     
     
         7 . The wafer processing equipment of  claim 4 , wherein said covering disk defines a through hole, whereby said spindle of said driving device can be inserted through said through hole of said covering disk. 
     
     
         8 . The wafer processing equipment of  claim 1 , which further comprises a cooling device adapted to be mounted on the working machine, said cooling device provided with an inlet and an outlet, said outlet located adjacent to said processing wheel, said inlet adapted to be connected to a liquid source, whereby liquid from the liquid source can flow into said inlet and flow out of said outlet. 
     
     
         9 . The wafer processing equipment of  claim 8 , wherein liquid from the liquid source is served as a coolant.