Electronic circuit and heat sink

Abstract

An electronic circuit of the present invention includes: a circuit board on which an electronic component is mounted; a heat conducting sheet stacked on the electronic component; and a heat sink stacked on the heat conducting sheet. The heat sink includes a porous ceramics having a volume resistivity of 10 10 Ohm·cm or more and a porosity of 15-50 vol %.

1 . An electronic circuit comprising:
 a circuit board on which an electronic component is mounted;   a heat conducting sheet stacked on the electronic component; and   a heat sink stacked on the heat conducting sheet,   wherein the heat sink comprises a porous ceramics having a volume resistivity of 10 10  Ohm·cm or more and a porosity of 15-50 vol %, and   the porous ceramics is made by sintering granulated particles obtained by mixing at least silica dioxide, alumina and silicon carbide, and each particle of the granulated particles has a particle diameter of 10 μm or more.   
     
     
         2 . A heat sink comprising a porous ceramics having a volume resistivity of 10 10  Ohm·cm or more and a porosity of 15-50 vol %,
 wherein the porous ceramics is made by sintering granulated particles obtained by mixing at least silica dioxide, alumina and silicon carbide, and each particle of the granulated particles has a particle diameter of 10 μm or more. 
 
     
     
         3 . (canceled) 
     
     
         4 . The heat sink according to  claim 2 , wherein the silicon carbide has an average particle diameter of 150 μm or less. 
     
     
         5 . The heat sink according to  claim 2 , wherein the porous ceramics includes 60-85 weight % of the silicon carbide and at least 10 weight % or more of the silica dioxide. 
     
     
         6 . The heat sink according to  claim 4 , wherein the porous ceramics includes 60-85 weight % of the silicon carbide and at least 10 weight % or more of the silica dioxide.