Heat dissipation base and method of manufacturing same

Abstract

A heat dissipation base includes a heat conducting element having a first surface and an opposite second surface; and a main body having a recess, a first side, and an opposite second side. The recess is communicable with the first and the second side, and the heat conducting element is set in the first side of the main body with the second surface being flush with the recess. The heat conducting element and the main body are integrally associated with each other by way of insert molding to achieve the purpose of lowered manufacturing cost and reduced overall weight of the heat dissipation base. A method of manufacturing the heat dissipation base is also disclosed.

What is claimed is: 
     
         1 . A heat dissipation base, comprising:
 a heat conducting element having a first surface and an opposite second surface; and   a main body having a recess, a first side, and an opposite second side; and the recess being communicable with both of the first and the second side; and   wherein the heat conducting element is set in the first side of the main body with the second surface of the heat conducting element being flush with the recess; the main body is made of a polymeric material; and the heat conducting element is integrally associated with the main body by way of insert molding.   
     
     
         2 . The heat dissipation base as claimed in  claim 1 , wherein the heat conducting element is made of a material selected from the group consisting of a copper material, an aluminum material, a stainless steel material, and a graphite material. 
     
     
         3 . The heat dissipation base as claimed in  claim 1 , wherein the recess further includes an open top side and a bottom side, and the main body further has at least one arm portion provided at boundaries between the second side and the open top side of the recess to extend over across the open top side. 
     
     
         4 . The heat dissipation base as claimed in  claim 1 , further comprising a fixing element extending over across the recess. 
     
     
         5 . The heat dissipation base as claimed in  claim 1 , further comprising a heat pipe received in the recess; and the heat pipe having at least one flat side bearing on the second surface of the heat conducting element. 
     
     
         6 . The heat dissipation base as claimed in  claim 5 , wherein the heat pipe and the heat conducting element have a heat conducting medium provided between them. 
     
     
         7 . The heat dissipation base as claimed in  claim 1 , wherein the main body further has a third side and an opposite fourth side; and the third and the fourth side respectively having at least one mounting member connected thereto. 
     
     
         8 . The heat dissipation base as claimed in  claim 1 , wherein the heat conducting element further has a connecting section provided along an outer periphery thereof; and the connecting section having an outer surface selected from the group consisting of a roughened surface, an uneven surface, a hooked surface, a corrugated surface, and a toothed surface. 
     
     
         9 . The heat dissipation base as claimed in  claim 1 , wherein the heat conducting element is provided on the second surface with at least one sunken section. 
     
     
         10 . A method of manufacturing heat dissipation base, comprising the following steps: providing a heat conducting element and at least one heat pipe; forming a base main body around the heat conducting element by molding; and fixedly attaching the heat pipe to one surface of the heat conducting element. 
     
     
         11 . The method of manufacturing heat dissipation base as claimed in  claim 10 , wherein the heat pipe is fixedly attached to the heat conducting element through mechanical processing. 
     
     
         12 . The method of manufacturing heat dissipation base as claimed in  claim 11 , wherein the mechanical processing is selected from the group consisting of tight fitting, scarf joining, adhesive-bonding, and welding. 
     
     
         13 . The method of manufacturing heat dissipation base as claimed in  claim 10 , wherein the base main body is formed around the heat conducting element by way of injection molding. 
     
     
         14 . The method of manufacturing heat dissipation base as claimed in  claim 10 , wherein the base main body is made of a plastic material.