Flexible micro-system and fabrication method thereof

Abstract

A fabrication method for integrating chip(s) onto a flexible substrate in forming a flexible micro-system. The method includes a low-temperature flip-chip and a wafer-level fabrication process. Using the low-temperature flip-chip technique, the chip is bonded metallically onto the flexible substrate. To separate the flexible substrate from the substrate, etching is used to remove the sacrificial layer underneath the flexible substrate. The instant disclosure applies standardized micro-fabrication process for integrating chip(s) onto the flexible substrate. Without using special materials or fabrication procedures, the instant disclosure offers a cost-effective fabrication method for flexible micro-systems.

What is claimed is: 
     
         1 . A flexible micro-system, comprising:
 a flexible substrate and at least one electronic component, wherein the electronic component is bonded to the flexible substrate by a metal interconnection structure, wherein the interconnection is achieved by bonding the first conductive structure of the flexible substrate to the second conductive structure of the electronic component at low temperature.   
     
     
         2 . The flexible micro-system of  claim 1 , wherein the flexible micro-system is mounted on a flexible supporting substrate. 
     
     
         3 . The flexible micro-system of  claim 1 , further comprising a secondary flexible substrate partially covering the first conductive structure, wherein the first conductive structure is disposed (deposited) between the flexible substrate and the secondary flexible substrate, wherein the first conductive structure is partially exposed from the secondary flexible substrate. (“dispose” is a magical verb in patent claiming; this verb can be construed broadly to cover the scope of “deposit”. I would suggest retaining “dispose” to keep the scope of the patent claim broad.)