Electronic component board and production method of the same

Abstract

An electronic component board is made by attaching bus bars to an insulating plate, and by electrically connecting electronic components to the bus bars. In the electronic component board, heat radiating portions integrally formed with specific bus bars are provided along an outer periphery of the insulating plate. A width of a portion extended parallel to the outer periphery of the insulating plate of the heat radiating portion is constant. The electronic component board 1 is produced by die-cutting a metal plate in a lump into the bus bars and a band-shaped connecting portion connected to the bus bars, having a constant width, and positioned at an outer edge of the metal plate, by attaching the bus bars to the insulating board, and by cutting and removing the connecting portion while leaving a part of the connecting portion uncut which is used as the heat radiating portion.

1 . An electronic component board comprising:
 an insulating plate;   a plurality of bus bars attached to the insulating plate; and electronic components electrically   connected to the bus bars, wherein a plurality of heat radiating portions are integrally formed with any of the bus bars, and provided along an outer periphery of the insulating plate, and   wherein a width of each heat radiating portion extended parallel to the outer periphery of the insulating plate is constant.   
     
     
         2 . The electronic component board as claimed in  claim 1 ,
 wherein the bus bar integrally formed with the heat radiating portion includes: a component mount portion on which the electronic component is mounted; a terminal portion to which an external terminal is connected; and an intermediate portion positioned between the component mount portion and the terminal portion, and   wherein the width of each heat radiating portion extended parallel to the outer periphery of the insulating plate is wider than a width of the intermediate portion.   
     
     
         3 . The electronic component board as claimed in  claim 1 , wherein the heat radiating portion is extended vertically in a thickness direction of the insulating plate. 
     
     
         4 . A production method of the electronic component board as claimed in  claim 1 , said method comprising the steps of:
 die-cutting a metal plate in a lump into a plurality of bus bars and a band-shaped connecting portion connected to the bus bars,   having a constant width, and positioned at an outer edge of the metal plate;   attaching the bus bars connected to the connecting portion to an insulating board; and then   cutting and removing the connecting portion while leaving a part of the connecting portion uncut which is used as a heat radiating portion.   
     
     
         5 . The electronic component board as claimed in  claim 2 ,
 wherein the heat radiating portion is extended vertically in a thickness direction of the insulating plate.   
     
     
         6 . A production method of the electronic component board as claimed in  claim 2 , said method comprising the steps of:
 die-cutting a metal plate in a lump into a plurality of bus bars and a band-shaped connecting portion connected to the bus bars,   having a constant width, and positioned at an outer edge of the metal plate;   attaching the bus bars connected to the connecting portion to an insulating board; and then   cutting and removing the connecting portion while leaving a part of the connecting portion uncut which is used as a heat radiating portion.   
     
     
         7 . A production method of the electronic component board as claimed in  claim 3 , said method comprising the steps of:
 die-cutting a metal plate in a lump into a plurality of bus bars and a band-shaped connecting portion connected to the bus bars,   having a constant width, and positioned at an outer edge of the metal plate;   attaching the bus bars connected to the connecting portion to an insulating board; and then   cutting and removing the connecting portion while leaving a part of the connecting portion uncut which is used as a heat radiating portion.   
     
     
         8 . A production method of the electronic component board as claimed in  claim 5 , said method comprising the steps of:
 die-cutting a metal plate in a lump into a plurality of bus bars and a band-shaped connecting portion connected to the bus bars,   having a constant width, and positioned at an outer edge of the metal plate;   attaching the bus bars connected to the connecting portion to an insulating board; and then   cutting and removing the connecting portion while leaving a part of the connecting portion uncut which is used as a heat radiating portion.