Roll-to-roll compatible pressure sensitive event sensing label

Abstract

The present invention discloses a smart label to be affixed on or integrated in an object and able to provide an electrical signal indicative of the applied pressure or force and/or the position of the applied pressure or force at a touch point on the object to which the label is affixed. The smart label comprises a layer structure and a detector system, the layer structure comprising of at least a stack of a first, a second and a third layer. The first and third layers comprise a flexible, electrically conductive or semiconductive material and at least two electrodes for connecting the layers to the detector system. The second layer comprises a flexible, deformable and compressible material. The second layer is electrically nonconductive or electrically conductive but less conductive than the first and third layers, wherein the second layer separates the first and third layers.

What is claimed is: 
     
         1 . A method for manufacturing a layer structure having at least three layers, the method comprising:
 providing first and third flexible layers formed from one or more materials selected from a group consisting of: an electrically conductive material and a semiconductor material;   providing a second layer that is electrically less conductive than the first and third layers and comprises a non-conductive spacer grid having air voids; and   arranging the second layer between the first and third layers.   
     
     
         2 . The method for manufacturing the layer structure according to  claim 1 , comprising arranging a first electrode on the first layer and a second electrode on the third layer. 
     
     
         3 . The method for manufacturing the layer structure according to  claim 1 , comprising arranging at least one additional electrode on the first layer and the third layer. 
     
     
         4 . The method for manufacturing the layer structure according to  claim 1 , comprising microstructuring the first and/or the third layer by providing conductive paths on the first and/or the third layer, respectively. 
     
     
         5 . The method for manufacturing the layer structure according to  claim 4 , wherein the conductive paths have a higher conductivity than the material of the first and the third layer. 
     
     
         6 . The method for manufacturing the layer structure according to  claim 4 , wherein the conductive paths are transparent or semitransparent. 
     
     
         7 . The method for manufacturing the layer structure according to  claim 4 , wherein microstructuring comprises providing a −0pattern of conductive crosses on the first layer and a pattern of conductive and substantially concentric circles on the third layer. 
     
     
         8 . The method for manufacturing the layer structure according to  claim 7 , wherein the microstructuring is performed so that the pattern of conductive crosses is substantially in alignment with the pattern of conductive and substantially concentric circles. 
     
     
         9 . The method for manufacturing the layer structure according to  claim 4 , wherein the first and the third layers are microstructured so that the first and the third layers have a gradient of increased conductivity the further away from the first and the second electrode. 
     
     
         10 . The method for manufacturing the layer structure according to  claim 1 , wherein the second layer comprises a grid material made of transfer glue. 
     
     
         11 . The method for manufacturing the layer structure according to  claim 1 , comprising integrating a display element into the layer structure. 
     
     
         12 . The method for manufacturing the layer structure according to  claim 10 , wherein the display element is a flexible display element. 
     
     
         13 . The method for manufacturing the layer structure according to  claim 1 , comprising providing an optical security feature to the stack of layers. 
     
     
         14 . The method for manufacturing the layer structure according to  claim 1 , further comprising:
 providing the stack of layers on an object such that a change in the distance between the first and the third layer is obtained by at least by either one of the following:
 manipulation of the object; and 
   the application of force on the stack of layers which in turn causes manipulation of the object.   
     
     
         15 . The method for manufacturing the layer structure according to  claim 14 , wherein the object is a package. 
     
     
         16 . The method for manufacturing the layer structure according to  claim 1 , comprising thermoforming the stack of layers into the form of a package. 
     
     
         17 . The method for manufacturing the layer structure according to  claim 16 , wherein the package is a blister package. 
     
     
         18 . The method for manufacturing the layer structure according to  claim 1 , comprising providing the first, second and third layer to obtain the stack of layers by employing a roll-to-roll, reel-to-reel or sheet-to-sheet manufacturing process. 
     
     
         19 . A method for manufacturing a layer structure having at least three layers, the method comprising:
 providing first and third flexible layers each having a gradient of increased conductivity in at least one of a vertical or horizontal direction and formed from one or more materials selected from a group consisting of: an electrically conductive material, and a semiconductor material;   providing a second layer that is electrically less conductive than the first and third layers; and   arranging the second layer between the first and third layer.   
     
     
         20 . A method for manufacturing a layer structure having at least three layers, the method comprising:
 providing first and third flexible layers respectively having a pattern of conductive crosses and a pattern of concentric circles and formed from one or more materials selected from a group consisting of: an electrically conductive material, and a semiconductor material;   providing a second layer that is electrically less conductive than the first and third layers; and   arranging the second layer between the first and third layer so that the pattern of crosses on the first layer is aligned with the pattern of concentric circles on the third layer.