Methods of measuring a characteristic of a creping adhesive film and methods of modifying the creping adhesive film

Abstract

Described herein are quartz crystal microbalance (QCM) and quartz crystal microbalance with dissipation (QCMD) techniques that can be used for measuring characteristics of a creping adhesive film similar to the creping adhesive film that is formed on a Yankee dryer during the tissue and towel manufacturing process. In addition, exemplary embodiments described herein may use these techniques to predict performance of creping aids utilized to form a creping adhesive film.

We claim at least the following: 
     
         1 . A method of measuring a characteristic of a creping adhesive film, comprising:
 disposing a creping adhesive film on a sensor substrate;   measuring an oscillation frequency of the sensor substrate having the creping adhesive film disposed thereon using a Quartz Crystal Microbalance (QCM) technique; and   determining a characteristic of the creping adhesive film.   
     
     
         2 . The method of  claim 1 , further comprising: measuring an oscillation frequency dissipation of the sensor substrate after the driving potential is removed from the sensor substrate. 
     
     
         3 . The method of  claim 1 , further comprising:
 exposing the sensor substrate to a humid environment, wherein the creping adhesive film absorbs water from the humid environment; and   measuring an oscillation frequency of the sensor substrate using a QCM technique.   
     
     
         4 . The method of  claim 3 , further comprising: measuring an oscillation frequency dissipation of the sensor substrate after the driving potential is removed from the sensor substrate. 
     
     
         5 . The method of  claim 1 , further comprising:
 disposing a quantity of water onto the creping adhesive film, wherein the creping adhesive film absorbs the water; and   measuring an oscillation frequency of the sensor substrate using a QCM technique.   
     
     
         6 . The method of  claim 5 , further comprising: measuring an oscillation frequency dissipation of the sensor substrate after the driving potential is removed from the sensor substrate. 
     
     
         7 . The method of  claim 1 , wherein the characteristic is selected from the group consisting of: percent solubility, percent insolubility, rewet ratio, swelling ratio, film viscosity, film elasticity, film softness, film rigidity, shear modulus, and a combination thereof. 
     
     
         8 . The method of  claim 1 , wherein measuring an oscillation frequency includes measuring at two or more frequencies that are applied to the sensor substrate. 
     
     
         9 . The method of  claim 1 , wherein exposing the sensor substrate includes exposing the sensor substrate at a first temperature, wherein the first temperature is a temperature of about 10 to 100° C. 
     
     
         10 . The method of  claim 9 , further comprising:
 measuring an oscillation frequency of the sensor substrate at two or more temperatures using the QCM technique.   
     
     
         11 . The method of  claim 1 , wherein the creping adhesive film includes one or more creping adhesives. 
     
     
         12 . The method of  claim 11 , wherein the creping adhesive film includes a component selected from the group consisting of: a release aid, a modifier, a plasticizer, a humectant, a phosphate, a creping additive, and a combination thereof. 
     
     
         13 . The method of  claim 11 , wherein the creping adhesive film includes a component selected from the group consisting of: a mineral, a hemicellulose, a fiber, a fine, a fiber fragment, and a combination thereof. 
     
     
         14 . The method of  claim 11 , wherein the creping adhesive film includes a component selected from the group consisting of: a softener, a debonder, a defoamer, a wet strength resin, a dry strength resin, a charge control agent, a retention aid, a biocide, a dye, and a combination thereof. 
     
     
         15 . The method of  claim 1 , wherein the QCM technique includes Quartz Crystal Microbalance with Dissipation (QCMD). 
     
     
         16 . A method for modifying the creping adhesive film disposed on a Yankee dryer, comprising:
 obtaining a sensor substrate having a creping adhesive film disposed thereon, wherein the creping adhesive film has a composition that is the same as a creping adhesive film disposed on a Yankee dryer;   measuring an oscillation frequency of the sensor substrate having the creping adhesive film disposed thereon using a Quartz Crystal Microbalance (QCM) technique;   determining a characteristic of the creping adhesive film; and   modifying a composition of the creping adhesive film disposed on the Yankee dryer based on the determination of the characteristic.   
     
     
         17 . The method of  claim 16 , wherein the characteristic is selected from the group consisting of: percent solubility, percent insolubility, rewet ratio, swelling ratio, film viscosity, film elasticity, film softness, film rigidity, shear modulus, and a combination thereof. 
     
     
         18 . The method of  claim 16 , wherein the creping adhesive disposed on the sensor is obtained from a device that provides the components of the creping adhesive film to the Yankee dryer. 
     
     
         19 . The method of  claim 16 , further comprising: determining how to adjust one or more components of the composition of the creping adhesive film to achieve adjustment of a characteristic of the creping adhesive film. 
     
     
         20 . The method of  claim 19 , wherein the components are selected from the group consisting of: a creping adhesive, a release aid, a modifier, a plasticizer, a humectant, a phosphate, a creping additive, a mineral, a hemicellulose, a fiber, a fine, a softener, a debonder, a defoamer, a wet strength resin, a dry strength resin, a charge control agent, a retention aid, a biocide, a dye, and a combination thereof; and wherein the characteristic is selected from the group consisting of: percent solubility, percent insolubility, rewet ratio, swelling ratio, film viscosity, film elasticity, film softness, film rigidity, shear modulus, and a combination thereof.