Wafer Polishing Pad Holder Template

Abstract

A system for processing wafers that will reduce the amount of time required for polishing wafers, increase worker safety while performing the process and increase the percentage of acceptable wafers after processing.

What is claimed is new and desired to be protected by Letters Patent is set forth in the appended claims: 
     
         1 . A wafer polishing pad holder comprising:
 a) a substantially circular pad holder base having a top peripheral side, a bottom side and a grid-like plurality of ribs defining a plurality of milled islands;   b) a polishing pad holder ring substantially conforming to said pad holder base with a peripheral top and bottom side that along with said pad holder base forms a cavity therein;   c) means for adhesively securing said pad holder base to a work surface;   d) means for adhesively securing said pad holder ring to said pad holder base; and   e) at least one disc for insertion into said cavity.   
     
     
         2 . The wafer polishing pad holder according to  claim 1 , wherein said pad holder base and said pad holder ring include corresponding milled recess notches disposed interiorly therein. 
     
     
         3 . The wafer polishing pad holder according to  claim 1 , wherein said means for securing said pad holder base to a work surface is adhesive tape adhesively secured to said bottom of said pad holder base and covered by a removable paper liner until ready for use. 
     
     
         4 . The wafer polishing pad holder according to  claim 1 , wherein said means of securing said pad holder ring to said pad holder base is double sided adhesive tape shaped to conform to and disposed on said bottom peripheral side of said ring with a paper backing to protect the opposing layer of adhesive until ready for installation onto said base. 
     
     
         5 . The wafer polishing pad holder according to  claim 1 , wherein said polishing pad holder ring is manufactured of a non-metallic material. 
     
     
         6 . The wafer polishing pad holder according to  claim 1 , wherein said at least one disc is a polishing disc. 
     
     
         7 . The wafer polishing pad holder according to  claim 6 , wherein said at least one polishing disc is a plurality of polishing discs having a plurality of thicknesses and textures of abrasiveness. 
     
     
         8 . The wafer polishing pad holder according to  claim 7 , wherein said at least one polishing disc is a non-spin disc having a plurality of disc tabs projecting outwardly therefrom conforming to said milled recess notches to prevent the casual rotation thereof within said cavity during the polishing process. 
     
     
         9 . The wafer polishing pad holder according to  claim 7 , wherein said polishing pad disc is double sided having differing textures on each side thereby enabling the user to simply turn over said disc according to the task to be performed. 
     
     
         10 . The wafer polishing pad holder according to  claim 1 , wherein said at least one said disc is a spacer disc for placement beneath said polishing disc to enable the user to selectively raise and lower the level of said polishing disc. 
     
     
         11 . The wafer polishing pad holder according to  claim 1 , wherein said cavity is at least two inches deep. 
     
     
         12 . The wafer polishing pad holder according to  claim 11 , wherein a quantity of water or abrasive slurry is introduced into said cavity and retained therein. 
     
     
         13 . The wafer polishing pad holder according to  claim 1 , wherein said at least one disc is a clear, shiny non-adhesive Mylar disc disposed within said cavity to reduce wear and extend the usable life of said base. 
     
     
         14 . The wafer polishing pad holder according to  claim 1 , wherein said at least one disc is a plastic material surface disc with milled islands on both sides. 
     
     
         15 . The wafer polishing pad holder according to  claim 7 , wherein said at least one polishing disc is at least one spinning disc and spacer disc that has a substantially circular configuration and rotates within said cavity. 
     
     
         16 . The wafer polishing pad holder according to  claim 7 , wherein said at least one disc is color coded to indicate the thickness and texture of said disc. 
     
     
         17 . The wafer polishing pad holder according to  claim 1 , wherein said at least one disc includes a similarly configured Napcon material film frictionally engaged with the top side thereof. 
     
     
         18 . The wafer polishing pad holder according to  claim 17 , wherein the user introduces said water or said abrasive slurry into said cavity along with selected polishing discs and spacer discs and said wafer polishing pad holder is ready for application.