US2013284323A1PendingUtilityA1

Cu-Co-Si-Zr ALLOY MATERIAL AND MANUFACTURING METHOD THEREOF

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Assignee: OKAFUJI YASUHIROPriority: Jan 13, 2011Filed: Jan 12, 2012Published: Oct 31, 2013
Est. expiryJan 13, 2031(~4.5 yrs left)· nominal 20-yr term from priority
C22C 9/06C22F 1/08H01B 13/00H01B 1/02H01B 1/026
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Claims

Abstract

The present invention relates to a Cu—Co—Si—Zr alloy material which contains 1.0-2.5 wt % of Co, 0.2-0.7 wt % of Si and 0.001-0.5 wt % of Zr with the elemental ratio Co/Si being 3.5-5.0. The Cu—Co—Si—Zr alloy material contains second phase particles having a diameter of 0.20 μm or more but less than 1.00 μm at a density of 3,000-500,000 particles/mm 2 , and has a crystal grain size of 10 μm or less, an electrical conductivity of 60% IACS or more and good bending workability. The alloy material can be produced by setting the temperature of heating that is carried out after casting and before a solution heat treatment to a temperature that is higher than the later-described solution heat treatment temperature by 45° C. or more, by setting the cooling rate from the start temperature of hot rolling to 600° C. to 100° C./min or less, and by selecting the solution heat treatment temperature from (50× Co wt %+775)° C. to (50× Co wt %+825)° C. (inclusive). The aging treatment after the solution heat treatment is preferably carried out at 450-650° C. for 1-20 hours.

Claims

exact text as granted — not AI-modified
1 . A Cu—Co—Si—Zr alloy material with good bending workability wherein said material comprises: 1.0 to 2.5 wt % of Co; 0.2 to 0.7 wt % of Si; and 0.001 to 0.5 wt % of Zr, and wherein a Co/Si elemental ratio is 3.5 to 5.0 and wherein said material contains 3,000 to 500,000 second phase particles per mm 2  having diameters of from 0.20 μm or more to less than 1.00 μm, and has an electrical conductivity EC of 60% IACS or more, and a grain size of 10 μm or less. 
     
     
         2 . The copper alloy material of  claim 1  containing 10 to 2,000 second phase particles per mm 2  having diameters of from 1.00 μm or more to 10.00 μm or less. 
     
     
         3 . The copper alloy material of  claim 1 , wherein the 0.2% yield strength YS is 600 MPa or more. 
     
     
         4 . A method of manufacturing the copper alloy material of  claim 1 , wherein the temperature of hot rolling (hot heating) performed after casting and before solution treatment is a temperature that is 45° C. or more higher than the solution treatment temperature selected below, the cooling rate from the temperature at the start of hot rolling to 600° C. is 100° C./min or lower, and the solution treatment temperature is selected from the range of from (50× Co wt %+775)° C. or more to (50× Co wt %+825)° C. or less. 
     
     
         5 . The method of manufacturing the copper alloy material of  claim 4 , wherein the aging treatment after solution treatment is at 450 to 650° C. for 1 to 20 hours.

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