US2013284406A1PendingUtilityA1
Temperature control device and method of manufacturing the same
Est. expiryJan 7, 2031(~4.5 yrs left)· nominal 20-yr term from priority
Inventors:Koichi Kawasaki
H10W 40/73B22D 23/003F28F 2255/00F28D 15/0275F28F 2275/00F28D 15/046Y10T29/49353B21D 53/02H05K 7/20336
35
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Claims
Abstract
A temperature control device includes a heat pipe including a heat absorption part provided at one end side and absorbing heat from an outside and a heat dissipation part provided at another end side and dissipating heat to the outside, and a heat absorption plate and a heat dissipation plate (heat conducting plates) made of metal films formed by powder including metal being accelerated with a gas toward at least one of external surfaces of the heat absorption part and the heat dissipation part of the heat pipe and being sprayed and deposited on the surfaces in a solid-phase state.
Claims
exact text as granted — not AI-modified1 . A temperature control device comprising:
a heat pipe including a heat absorption part provided at one end side and absorbing heat from an outside and a heat dissipation part provided at another end side and dissipating heat to the outside, and adapted to control a temperature of an object to be temperature-controlled; and a metal film formed by powder including metal being accelerated with a gas toward at least one of external surfaces of the heat absorption part and the heat dissipation part, and being sprayed and deposited on the surfaces in a solid-phase state.
2 . The temperature control device according to claim 1 ,
wherein a part of the external surface of the heat absorption part of the heat pipe is in contact with the object to be temperature-controlled, and the external surface other than a contact part is covered with the metal film.
3 . The temperature control device according to claim 1 ,
wherein the metal used for the metal film includes at least one kind selected from a group consisting of copper, molybdenum, aluminum, tungsten, silver, nickel, titanium, and a stainless based alloy or an alloy including at least one of copper, molybdenum, aluminum, tungsten, silver, nickel, and titanium.
4 . A method of manufacturing a temperature control device including a heat pipe adapted to control a temperature of an object to be temperature-controlled, the method comprising:
a step of forming a metal film by accelerating powder including metal with a gas toward a surface of at least one end portion of the heat pipe and by spraying and depositing the powder on the surface in a solid-phase state.
5 . The method of manufacturing a temperature control device according to claim 4 , further comprising:
a step of holding the heat pipe by a jig holding a part of the surface of the end portion of the heat pipe, and wherein the step of forming a metal film includes a first step of forming the metal film by accelerating powder including metal with a gas toward a surface exposed outside and of the heat pipe held by the jig in the step of holding the heat pipe, and by spraying and depositing the powder on the surface in a solid-phase state, and a second step of forming the metal film by removing the jig after the first step of forming the metal film, by accelerating powder including metal with a gas toward a surface of the heat pipe, having exposed outside, and by spraying and depositing the powder on the surface in a solid-phase state.
6 . The temperature control device according to claim 2 ,
wherein the metal used for the metal film includes at least one kind selected from a group consisting of copper, molybdenum, aluminum, tungsten, silver, nickel, titanium, and a stainless based alloy or an alloy including at least one of copper, molybdenum, aluminum, tungsten, silver, nickel, and titanium.Join the waitlist — get patent alerts
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