Method for vapor condensation and recovery

Abstract

Methods for recovery of precursor vapor from a gas and precursor vapor mixture used in a deposition process. The gas and precursor vapor mixture is passed through a multitude of heat transfer surfaces in a heat conducting housing causing the precursor vapor to condense. The precursor vapor in liquid form is then collected after condensation.

What is claimed is: 
     
         1 . A method for recovery of precursor vapor from a gas and precursor mixture after use in deposition in a semiconductor fabrication process, the method comprising:
 directing said gas and precursor mixture after deposition to pass through a multitude of heat transfer surfaces in a heat conducting housing causing precursor vapor in said gas and precursor mixture to condense; and   collecting precursor liquid formed from the precursor vapor condensation in a reservoir.   
     
     
         2 . The method of  claim 1  including the additional steps of removing heat produced by precursor vapor condensation by a thermal electric cooler; and dissipating the heat so removed through a multitude of heat transfer surfaces outside said housing. 
     
     
         3 . The method of  claim 1  including the additional step of passing said gas and precursor mixture through a filter to remove suspended particles in the mixture prior to the gas and precursor mixture's use in deposition. 
     
     
         4 . A method of fabricating integrated circuit devices including the steps of:
 generating a gas and precursor vapor mixture;   passing said gas and precursor vapor mixture through a deposition chamber to form a thin film on a substrate; and   condensing precursor vapor of said gas and precursor vapor mixture in a condenser to collect condensed precursor vapor in liquid form.   
     
     
         5 . The method of  claim 4  including the additional steps of removing heat produced by precursor vapor condensation by a thermal electric cooler; and dissipating the heat so removed through a multitude of heat transfer surfaces outside said housing. 
     
     
         6 . The method of  claim 4  including the additional step of passing said gas and precursor mixture through a filter to remove suspended particles in the mixture prior to the gas and precursor mixture entry into said deposition chamber.