US2013299355A1PendingUtilityA1
Surface cleaning and activation for electrodeposition in ionic liquids
Est. expiryMay 14, 2032(~5.8 yrs left)· nominal 20-yr term from priority
C25D 3/665C25D 3/44C25D 5/42C25D 5/44
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Abstract
A surface preparation solution comprises an ionic liquid solvent and a water and oxygen scavenging species. Methods for making the solution, and methods for using the solution to prepare and activate a substrate surface for bulk electrodeposition are also disclosed.
Claims
exact text as granted — not AI-modified1 . A surface preparation solution for electrodeposition in ionic liquids comprising:
an ionic liquid solvent; and a water and oxygen scavenging species.
2 . The solution of claim 1 , wherein the water and oxygen scavenging species comprises an acid halide including a halogen atom bonded to the carbon atom of a carbonyl group.
3 . The solution of claim 2 , further comprising a metal halide salt, wherein the halide of the salt is a halide form of the halogen atom bonded to the carbon atom of the carbonyl group.
4 . The solution of claim 2 , wherein the acid halide is an acid chloride.
5 . The solution of claim 1 , wherein the water and oxygen scavenging species comprises a member of the phosgene family.
6 . The solution of claim 5 , wherein the water and oxygen scavenging species exists in solution primarily as phosgene (carbonyl dichloride, COCl 2 ).
7 . The solution of claim 1 , wherein the water and oxygen scavenging species comprises a thionyl halide having a halogen atom bonded to the sulfur atom of a thionyl group.
8 . The solution of claim 7 , wherein the thionyl halide is thionyl chloride.
9 . The solution of claim 1 , wherein the ionic liquid solvent comprises at least one of: 1-ethyl-3-methylimidazolium chloride, 1 -butyl-3-methylimidazolium chloride, 1-butyl-1-methylpyrrolidinium bis (trifluoromethylsulfonyl) amide, 1-ethyl-3-methylimidazolium bis (trifluoromethylsulfonyl) amide, trihexyl-tetraadecyl phosphonium bis(trifluoromethylsulfonyl) amide, and mixtures thereof.
10 . A method for making a surface preparation and activation solution for ionic liquid electrodeposition, the method comprising:
providing an ionic liquid solvent compatible with the substrate surface and a species to be deposited from the ionic liquid; and adding a water and oxygen scavenging species to the ionic liquid solvent.
11 . The method of claim 10 , wherein the water and oxygen scavenging species is an acid halide including a halogen atom bonded to the carbon atom of a carbonyl group.
12 . The method of claim 10 , wherein the water and oxygen scavenging species is selected from the phosgene family.
13 . The method of claim 12 , wherein the water and oxygen scavenging species is added to the ionic liquid in at least one of a diphosgene form and a triphosgene form.
14 . The method of claim 10 , wherein the water and oxygen scavenging species is thionyl chloride.
15 . A method for preparing and activating a substrate surface for electrodeposition, the method comprising:
removing contamination and oxides from the substrate surface; drying the surface in a substantially oxygen and water free environment; and immersing the substrate surface into a surface preparation and activation solution, the solution comprising an ionic liquid solvent and a water and oxygen scavenging species.
16 . The method of claim 15 , wherein the removing step comprises both mechanical and chemical removal of the contamination and oxides.
17 . The method of claim 15 , wherein the drying step utilizes substantially pure dehumidified nitrogen.
18 . The method of claim 15 , wherein the water and oxygen scavenging species comprises an acid chloride.
19 . The method of claim 18 , wherein the water and oxygen scavenging species comprises at least one member of the phosgene family.
20 . The method of claim 15 , further comprising:
applying a reverse current during the immersing step to expedite scavenging of water and oxygen.
21 . A method for electrodepositing a bulk coating onto a substrate surface, the method comprising:
preparing and activating the substrate surface according to the method of claim 15 ; submerging the substrate surface into a coating solution, the solution comprising an ionic liquid solvent and a metal halide salt dissociated in the ionic liquid solvent; and applying an electrical current through the coating solution between an anode and the substrate surface operating as a cathode to deposit a bulk coating thereon.
22 . The method of claim 21 , wherein the metal halide salt comprises aluminum.
23 . The method of claim 21 , further comprising:
depositing a thin film layer onto the prepared and activated substrate surface.
24 . The method of claim 23 , wherein the thin film layer is a monolayer deposited via underpotential deposition.Cited by (0)
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