US2013303694A1PendingUtilityA1

Epoxy Resin Composition

45
Assignee: DEBIEN CHRISTIAANPriority: Jan 31, 2011Filed: Nov 7, 2011Published: Nov 14, 2013
Est. expiryJan 31, 2031(~4.6 yrs left)· nominal 20-yr term from priority
C08G 18/3829C08G 18/4812C08G 18/792C08G 18/4045C08L 63/00C08G 18/7825C08G 18/7831C08K 5/20C08G 18/225C08G 18/092C08L 75/00C08G 18/00C08G 2115/02
45
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

Curable composition obtained by combining and mixing an epoxy resin composition comprising an epoxy resin, a monool and/or polyol and a a compound comprising a carboxamide group, and a polyisocyanate composition comprising a polyisocyanate, a lithium halide and a urea compound, wherein the number of moles of lithium halide per isocyanate equivalent ranges of from 0.0001-0.04 and the number of urea+biuret equivalents per isocyanate equivalent of from 0.0001-0.4. The epoxy resin composition is claimed as well.

Claims

exact text as granted — not AI-modified
1 . An epoxy resin composition comprising an epoxy resin, a monool and/or a polyol and a carboxamide compound which comprises a carboxamide group having the structure —CO—NH 2  wherein the number of hydroxy equivalents per epoxy equivalent is 0.02-100 and preferably 0.03-50 and most preferably 0.05-10 and the number of carboxamide equivalents per epoxy equivalent is 0.0005-1 and preferably 0.005-0.7 and most preferably of 0.01-0.5. 
     
     
         2 . The epoxy resin composition according to  claim 1  wherein the monool and/or the polyol has an average nominal functionality of 1-8 and an average molecular weight of 32-8000 and wherein the number of hydroxy equivalents per epoxy equivalent is 0.05-10. 
     
     
         3 . The epoxy resin composition according to  claim 1  wherein the carboxamide compound has the structure NH 2 —CO—R wherein R is 1) hydrogen (—H), 2) —NR 1 R 2 , 3) hydrocarbyl having 1-20 carbon atoms and optionally comprising hydroxy, ether, halogen and/or amine groups, or 4) —R 3 —CO—NH 2 , wherein R 1  and R 2 , independently from each other, are selected from hydrogen, hydroxy, halogen and hydrocarbyl groups which hydrocarbyl groups have 1-10 carbon atoms and optionally comprise hydroxy, ether, halogen and/or amine groups and wherein R 3  is a bivalent hydrocarbon radical having up to 8 carbon atoms and mixtures of such compounds and wherein the number of carboxamide equivalents per epoxy equivalent is 0.01-0.5. 
     
     
         4 . The epoxy resin composition according to  claim 1  wherein the carboxamide compound has the structure NH 2 —CO—R wherein R is 1) —NR 1 R 2 , 2) alkyl having 1-10 carbon atoms and optionally comprising 1-3 hydroxy and/or ether groups, 3) phenyl or 4) tolyl, wherein R 1  and R 2 , independently from each other, are selected from hydrogen, hydroxy, phenyl, tolyl and alkyl having 1-6 carbon atoms and optionally comprising an hydroxy and/or an ether group and mixtures of such compounds. 
     
     
         5 . A process for making a composition according to  claim 1  wherein a mixture of the polyol and carboxamide compound is combined and mixed with the epoxy resin. 
     
     
         6 . A curable composition comprising a polyisocyanate composition, comprising a polyisocyanate, a lithium halide and a urea compound, having an average molecular weight of 500-15000 and optionally comprising biuret groups, and an epoxy resin composition according to  claim 1 , wherein the number of moles of lithium halide per isocyanate equivalent ranges of from 0.0001-0.04 and the number of urea+biuret equivalents per isocyanate equivalent ranges of from 0.0001-0.4 and the number of epoxy equivalents per isocyanate equivalent ranges of from 0.003-1. 
     
     
         7 . The curable composition according to  claim 6 , wherein the urea compound does not comprise other isocyanate-reactive groups than urea groups and wherein the number of urea+biuret equivalents per isocyanate equivalent is 0.001-0.2 and wherein the urea compound has been prepared by reacting a methylene diphenyl diisocyanate or a polyisocyanate comprising a methylene diphenyl diisocyanate or a mixture of these polyisocyanates with a polyoxyalkylene monoamine comprising oxypropylene groups in an amount of at least 50% by weight calculated on the total weight of the monoamine molecule and having an average molecular weight of 200-3000 and wherein the amine is a primary amine and wherein the number of urea+biuret equivalents per mole of lithium halide is 0.5-60. 
     
     
         8 . The curable composition according to  claim 6 , wherein the polyisocyanate is a methylene diphenyl diisocyanate or a polyisocyanate composition comprising methylene diphenyl diisocyanate or a mixture of such polyisocyanates. 
     
     
         9 . The curable composition according to  claim 6 , wherein the amount of lithium halide is 0.00015-0.025 moles per isocyanate equivalent. 
     
     
         10 . The curable composition according to  claim 6 , wherein the lithium halide is lithium chloride. 
     
     
         11 . The curable composition according to  claim 6 , wherein the epoxy resin is liquid at 20-25° C. 
     
     
         12 . A process for making a curable composition according to  claim 6 , by combining and mixing the polyisocyanate composition described in  claim 6  and the epoxy resin composition described in  claim 6 , the amount of epoxy resin composition being such that the number of epoxy equivalents per isocyanate equivalent ranges from 0.003-1. 
     
     
         13 . A polyurethane polyisocyanurate material made by allowing a curable composition according to  claim 6  to react at elevated temperature. 
     
     
         14 . A polyurethane polyisocyanurate material obtainable by allowing a curable composition according to  claim 6  to react at elevated temperature. 
     
     
         15 . A process for making a polyurethane polyisocyanurate material according to  claim 13  by allowing the curable composition according to  claim 6  to react at elevated temperature. 
     
     
         16 . (canceled)

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.