Heat dissipation device with fastener

Abstract

A heat dissipation device includes a conductive plate and a fastener. The fastener includes a fastening element and an elastic element coiled around the fastening element. The fastening element includes a pole portion and a head portion formed at one end of the pole portion. The conductive plate defines a supporting portion through the conductive plate. The supporting portion includes a hole and a groove communicating with the hole. A flange protrudes from a circumference of the pole portion. The pole portion enters the groove. The flange abuts a bottom of the conductive plate. The elastic element elastically abuts the top of the conductive plate.

What is claimed is: 
     
         1 . A heat dissipation device, comprising:
 a conductive plate defining a supporting portion through the conductive plate, the supporting portion comprising a hole and a first groove communicating with the hole; and   a fastener comprising a fastening element and an elastic element around the fastening element, the fastening element comprising a pole portion, a head portion formed at one end of the pole portion, an engaging portion formed at another opposite end of the pole portion, and a flange protruding from an outer periphery of the pole portion between the engaging portion and the head portion, the flange having a diameter smaller than that of the hole but larger than a diameter of the first groove of the supporting portion, the pole portion having a diameter smaller than that of the first groove, the flange extending through the hole from a top side of the conductive plate, whereby the elastic element and the flange are respectively located at top and bottom sides of the conductive plate, the fastening element being then moved horizontally towards the first groove, whereby the pole portion enters the first groove, the flange abuts the bottom side of the conductive plate at a periphery of the first groove, the elastic element elastically abuts against the top side of the conductive plate at the periphery of the first groove.   
     
     
         2 . The heat dissipation device of  claim 1 , wherein the supporting portion further comprises a second groove communicating with the hole and the first groove, the second groove being located above and coaxial with the first groove, the second groove having a diameter larger than that of the hole, a step portion being formed at a joint of the first and second grooves, the elastic element being received in the second groove and elastically abutting the step portion. 
     
     
         3 . The heat dissipation device of  claim 1 , wherein the hole extends through the conductive plate and communicating with an outer edge of the conductive plate. 
     
     
         4 . The heat dissipation device of  claim 3 , wherein a protrusion protrudes from the bottom side of the conductive plate corresponding to the supporting portion, a concave portion being defined in the top side of the conductive plate corresponding to the protrusion, the hole and the first groove extending through the protrusion. 
     
     
         5 . The heat dissipation device of  claim 1 , wherein the hole extends through the conductive plate and is spaced from an outer edge of the conductive plate. 
     
     
         6 . The heat dissipation device of  claim 5 , wherein a protrusion protrudes from the bottom side of the conductive plate corresponding to the supporting portion, a concave portion being defined in the top side of the conductive plate corresponding to the protrusion, the hole and the first groove extending through the protrusion. 
     
     
         7 . The heat dissipation device of  claim 1 , wherein the elastic element has an inner diameter larger than the diameter of the flange, the flange extending through the elastic element, the elastic element being sleeved on the pole portion of the fastening element. 
     
     
         8 . The heat dissipation device of  claim 1 , wherein a limiting portion protrudes from the circumference of the pole portion adjacent to the head portion, the limiting portion has a diameter smaller than the inner diameter of the elastic element. 
     
     
         9 . The heat dissipation device of  claim 1 , wherein the head portion has a diameter larger than the inner diameter of the elastic element, the elastic element being compressed between the head portion and the conductive plate. 
     
     
         10 . A heat dissipation device, comprising:
 a conductive plate defining a supporting portion through the conductive plate, the supporting portion comprising a hole and a first groove communicating with the hole; and   a fastener comprising a fastening element and a elastic element around the fastening element, the fastening element comprising a pole portion, a head portion formed at one end of the pole portion, and a flange protruding from an outer periphery of the pole portion, the elastic element having an outer diameter larger than a diameter of the hole, the flange having a diameter smaller than that of the hole but larger than a diameter of the first groove of the supporting portion, the pole portion having a diameter smaller than that of the first groove, the flange extending through the hole from a top side of the conductive plate, whereby the flange is located at a bottom side of the conductive plate, the elastic element elastically abuts the top side of the conductive plate at a periphery of the hole, the fastening element being then moved horizontally towards the first groove, whereby the pole portion enters the first groove, the flange abuts the bottom side of the conductive plate at a periphery of the first groove, the elastic element elastically abuts against the top side of the conductive plate at the periphery of the first groove.   
     
     
         11 . The heat dissipation device of  claim 10 , wherein the supporting portion further comprises a second groove communicating with the hole and the first groove, the second groove being located above and coaxial with the first groove, the second groove having a diameter larger than that of the hole, a step portion being formed at a joint of the first and second grooves, the elastic element being received in the second groove and elastically abutting the step portion. 
     
     
         12 . The heat dissipation device of  claim 10 , wherein the hole extends through the conductive plate and communicating with an outer edge of the conductive plate. 
     
     
         13 . The heat dissipation device of  claim 12 , wherein a protrusion protrudes from the bottom side of the conductive plate corresponding to the supporting portion, a concave portion being defined in the top side of the conductive plate corresponding to the protrusion, the hole and the first groove extending through the protrusion. 
     
     
         14 . The heat dissipation device of  claim 10 , wherein the hole extends through the conductive plate and is spaced from an outer edge of the conductive plate. 
     
     
         15 . The heat dissipation device of  claim 14 , wherein a protrusion protrudes from the bottom side of the conductive plate corresponding to the supporting portion, a concave portion being defined in the top side of the conductive plate corresponding to the protrusion, the hole and the first groove extending through the protrusion. 
     
     
         16 . The heat dissipation device of  claim 10 , wherein an inner diameter of the elastic element is larger than the diameter of the flange, the flange extending through the elastic element, the elastic element being sleeved on the pole portion of the fastening element. 
     
     
         17 . The heat dissipation device of  claim 10 , wherein a limiting portion protrudes from the outer periphery of the pole portion adjacent to the head portion, the limiting portion has a diameter smaller than an inner diameter of the elastic element. 
     
     
         18 . The heat dissipation device of  claim 10 , wherein the head portion has a diameter larger than the inner diameter of the elastic element, the elastic element being compressed between the head portion and the conductive plate.