Printed circuit board

Abstract

A printed circuit board includes a power supply, a plurality of loads, a copper sheet, and a plurality of metal sheets mounted onto the copper sheet. The copper sheet is electronically connected between the power supply and the loads. The power supply outputs a plurality of currents to the loads via a plurality of current traces passing through the copper sheet, the plurality of metal sheets are located along the plurality of current traces.

What is claimed is: 
     
         1 . A printed circuit board, comprising:
 a power supply;   a load;   a copper sheet electronically connected between the power supply and the load; and   a metal sheet mounted onto the copper sheet.   
     
     
         2 . The printed circuit board of  claim 1 , wherein the metal sheet comprises a solder surface and at least one solder pad protruding from the solder surface, the metal sheet is soldered onto the copper sheet through the solder pad. 
     
     
         3 . The printed circuit board of  claim 2 , wherein insulating paint coats the surface of the metal sheet except for the pads. 
     
     
         4 . The printed circuit board of  claim 1 , wherein the metal sheet is made from the group consisting of copper, iron, and silver. 
     
     
         5 . The printed circuit board of  claim 1 , wherein a package of the metal sheet is one of imperial 1210 and imperial 2512. 
     
     
         6 . The printed circuit board of  claim 1 , further comprising a plurality of metal sheets, wherein the plurality of metal sheets are arranged as a matrix array. 
     
     
         7 . A printed circuit board, comprising:
 a power supply;   a plurality of loads;   a copper sheet electronically connected between the power supply and the loads;   a plurality of metal sheets mounted onto the copper sheet; and   wherein the power supply outputs a plurality of currents to the loads via the copper sheet, to form a plurality of current traces that pass through the copper sheet, the plurality of metal sheets are located along the plurality of current traces.   
     
     
         8 . The printed circuit board of  claim 7 , wherein the metal sheets are located on a portion of the copper sheet where most current traces passed through. 
     
     
         9 . The printed circuit board of  claim 7 , wherein the metal sheets are spacingly located along one of the current traces. 
     
     
         10 . The printed circuit board of  claim 7 , wherein the metal sheet comprises a solder surface and at least one solder pad protruding from the solder surface, the metal sheet is soldered onto the copper sheet through the solder pad. 
     
     
         11 . The printed circuit board of  claim 10 , wherein insulating paint coats the surface of the metal sheet except for the pads. 
     
     
         12 . The printed circuit board of  claim 7 , wherein the metal sheet is made from the group consisting of copper, iron, and silver. 
     
     
         13 . The printed circuit board of  claim 7 , wherein a package of the metal sheet is one of imperial 1210 and imperial 2512. 
     
     
         14 . The printed circuit board of  claim 7 , further comprising a plurality of metal sheets, wherein the plurality of metal sheets are arranged as a matrix array.