Phase change type heat dissipating device

Abstract

A phase change type heat dissipating device for dissipating heat from a heat generating component includes a cavity and a working medium positioned in the cavity. The working medium is a kind of electrically insulated phase change material, and represents solid state at normal temperature. The heat generating component is received in the cavity.

What is claimed is: 
     
         1 . A phase change type heat dissipating device for removing heat from a heat generating component, comprising:
 a casing enclosing the heat generating component;   a working medium received in the casing;   wherein the working medium is electrically insulated and phase change material, the working medium represents solid state at normal temperature and is liquefied when the heat generating component works under high loading and the temperature of the heat generating component is higher than the normal temperature.   
     
     
         2 . The phase change type heat dissipating device of  claim 1 , wherein the working medium is made from hydrate, organic acid or esters. 
     
     
         3 . The phase change type heat dissipating device of  claim 1 , wherein the heat generating component electrically connects to external power source via printed circuit board or wire. 
     
     
         4 . The phase change type heat dissipating device of  claim 1 , comprising a top cover and a bottom plate opposite to the top cover, the working medium being disposed between the top cover and the bottom plate. 
     
     
         5 . The phase change type heat dissipating device of  claim 4 , wherein a plurality of sidewalls extend upward from a periphery of the bottom plate, and lateral walls being curved and extending horizontally from the top ends of the sidewalls, a bottom surface periphery of the top cover being attached to the lateral walls to form the cavity. 
     
     
         6 . The phase change type heat dissipating device of  claim 4 , wherein the heat generating component is located at the bottom plate. 
     
     
         7 . The phase change type heat dissipating device of  claim 1 , wherein a melting point of the working medium is between a temperature of the heat generating component under standby/low-loading and a temperature of the heat generating component under high-loading.