Systems and methods for applying protective coatings to internal surfaces of fully assembled electronic devices

Abstract

Methods for applying protective coatings to electronic devices that have already been assembled, and are in a consumer-ready or aftermarket form, are disclosed. In such a method, an electronic device may be at least partially disassembled to expose at least a portion of an interior of the electronic device. A protective coating is applied to some or all of the exposed surfaces of the electronic devices, including one or more internal surfaces, features or components of the electronic device. Thereafter, the electronic device may be reassembled. During and after reassembly, the protective coating resides internally within the electronic device. Systems for applying protective coatings to interior components of previously assembled electronic devices are also disclosed.

What is claimed: 
     
         1 . A method for applying a protective coating to a previously fully assembled electronic device, comprising:
 disassembling an electronic device that was previously fully assembled to expose one or more internal surfaces, features or components of the electronic device;   applying a protective coating to at least a portion of the internal surfaces, features or components; and   reassembling the electronic device with the protective coating located at least partially within an interior of the electronic device.   
     
     
         2 . The method of  claim 1 , wherein disassembling includes detaching two or more portions of a housing of the electronic device from one another. 
     
     
         3 . The method of  claim 2 , wherein disassembling includes removing a selectively detachable portion of the housing from a remainder of the housing. 
     
     
         4 . The method of  claim 1 , wherein disassembling includes removing a portion of a permanent housing of the electronic device. 
     
     
         5 . The method of  claim 1 , wherein disassembling includes removing one or more removable connectors securing together portions of a housing of the electronic device. 
     
     
         6 . The method of  claim 1 , wherein disassembling includes removing a portion of a housing of the electronic device. 
     
     
         7 . The method of  claim 6 , wherein reassembling includes closing an opening formed by removing material from an exterior of the electronic device. 
     
     
         8 . The method of  claim 1 , wherein disassembling includes removing one or more components from the electronic device and excluding the one or more components from applying the protective coating. 
     
     
         9 . The method of  claim 1 , further comprising:
 preventing application of the protective coating to one or more portions of the electronic device.   
     
     
         10 . The method of  claim 9 , wherein preventing includes:
 applying a mask or a coating release element to a portion of the electronic device.   
     
     
         11 . The method of  claim 10 , further comprising:
 after applying the protective material, removing the mask and any portion of the protective coating located over the mask or removing any portion of the protective coating located over the coating release element.   
     
     
         12 . The method of  claim 9 , wherein preventing includes restricting application of the protective coating to one or more peripheral or exterior surfaces of the electronic device. 
     
     
         13 . The method of  claim 9 , wherein preventing includes preventing application of the protective coating to electrical connectors of the electronic device. 
     
     
         14 . The method of  claim 9 , wherein preventing includes:
 after applying the protective coating, removing a portion of the protective coating from one or more surfaces, features or components of the electronic device.   
     
     
         15 . The method of  claim 1 , wherein applying the protective coating occurs while the one or more internal surfaces, features or components are carried by a housing of the electronic device. 
     
     
         16 . The method of  claim 1 , wherein applying the protective coating occurs while the one or more internal surfaces, features or components are separated from a housing of the electronic device. 
     
     
         17 . The method of  claim 1 , wherein reassembling includes reattaching at least two portions of the electronic device that form an exterior of the electronic device. 
     
     
         18 . The method of  claim 1 , wherein reassembling includes reestablishing one or more electrical connections between elements or components of the electronic device. 
     
     
         19 . The method of  claim 1 , wherein reassembling includes assembling an interior component that has been removed from a remainder of the electronic device. 
     
     
         20 . A method for applying a protective coating to an internal surface, feature or component of an electronic device, comprising:
 exposing an interior portion of an electronic device that was previously fully assembled;   applying a protective coating to one or more surfaces previously confined within an interior of the electronic device; and   preventing the protective coating from adhering to an exterior of the electronic device.   
     
     
         21 . The method of  claim 20 , further comprising:
 masking a surface of the electronic device; or   preventing a portion of the protective coating from adhering to a surface of the electronic device.   
     
     
         22 . The method of  claim 21 , further comprising:
 unmasking the surface after applying the protective coating, including exposing a surface through or laterally beyond the protective coating.   
     
     
         23 . The method of  claim 21 , further comprising:
 minimizing or eliminating exposure of the interior portion of the electronic device to an environment outside of the electronic device.   
     
     
         24 . The method of  claim 20 , wherein exposing the interior portion of the electronic device includes disassembling at least one portion of the electronic device defining at least a portion of an exterior of the electronic device. 
     
     
         25 . The method of  claim 20 , wherein exposing interior portion of the electronic device includes removing at least one component from an interior of the electronic device. 
     
     
         26 . A system for applying a protective coating to one or more internal surfaces, features or components of an electronic device, comprising:
 a disassembly element configured to expose at least a portion of an interior of an electronic device;   a coating element configured to apply a protective coating to at least a portion of the electronic device, including at least a portion of an internal surface, feature or component of the electronic device; and   a reassembly element configured to reassemble the electronic device with at least a portion of the protective coating located within an interior of the electronic device.   
     
     
         27 . The system of  claim 26 , further comprising:
 a masking element downstream from the disassembly element and upstream from the coating element, the masking element configured to apply a mask or coating release element to one or more areas of the electronic device to remain uncovered by the protective coating.   
     
     
         28 . The system of  claim 26 , wherein the coating element comprises a molecular diffusion apparatus. 
     
     
         29 . The system of  claim 26 , further comprising:
 a surface treatment element configured to modify a physical structure of at least one surface of the electronic device or the protective film.   
     
     
         30 . The system of  claim 26 , further comprising:
 at least one coating inspection element located downstream from the coating element.   
     
     
         31 . The system of  claim 26 , further comprising:
 a material removal element configured to remove material from at least one region of the protective coating.   
     
     
         32 . An electronic device, comprising:
 a body;   an aperture defined through the body;   a protective coating located inside the body at a location accessible from the aperture; and   a cover over the aperture and limiting exposure of the protective coating to an environment outside of the body.   
     
     
         33 . The electronic device of  claim 32 , wherein at least a portion of at least one surface within an interior of the body is exposed through or laterally beyond the protective coating located inside the body.