Method for selectively metallizing surface of ceramic substrate, ceramic product and use of ceramic product

Abstract

A method for metallizing a surface of a ceramic substrate includes molding and sintering a ceramic composition to obtain the ceramic substrate, in which the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder, radiating a predetermined region of the surface of the ceramic substrate, and performing chemical plating on the ceramic substrate.

1 . A method for selectively metallizing a surface of a ceramic substrate, comprising steps of:
 A) molding and sintering a ceramic composition to obtain the ceramic substrate, wherein the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder; the ceramic powder is at least one selected from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E; E is at least one selected from a group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, B, Al, Ga, Si, Ge, P, As, Sc, Y, Zr, Hf, and lanthanide elements; the functional powder is at least one selected from a group consisting of an oxide of M, a nitride of M, a oxynitride of M, a carbide of M, and a simple substance of M; and M is at least one selected from a group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, In, Sn, Sb, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu;   B) radiating a predetermined region of the surface of the ceramic substrate to form a chemical plating active region on the predetermined region of the surface of the ceramic substrate; and   C) performing chemical plating on the ceramic substrate formed with the chemical plating active region to form a metal layer on the predetermined region of the surface of the ceramic substrate.   
     
     
         2 . The method according to  claim 1 , wherein M is at least one selected from a group consisting of Fe, Co, Ni, Mn, Ti, Cu, Ta, W, Ce, Pr, Nd, Pm, Sm, Eu, and Gd. 
     
     
         3 . The method according to  claim 1 , wherein the functional powder is at least one selected from a group consisting of Fe 2 O 3 , CoO, NiO, MnO 2 , TiO 2 , CuO, TiC, TaON, TiC, W, CeO 2 , Pr, Nd 2 O 3 , Pm, Sm 2 O 3 , Eu 2 O 3 , Gd 2 O 3 , and CeN. 
     
     
         4 . The method according to  claim 1 , wherein E is at least one selected from a group consisting of Al, Zr, Si, Mg, and B. 
     
     
         5 . The method according to  claim 1 , wherein the ceramic powder is at least one selected from a group consisting of Al 2 O 3 , MgO, SiO 2 , ZrO 2 , BN, Si 3 N 4 , and SiC. 
     
     
         6 . The method according to  claim 1 , wherein based on the total weight of the ceramic composition, the amount of the ceramic powder is 70 wt % to 99.998 wt %, and the amount of the functional powder is 0.002 wt % to 30 wt %. 
     
     
         7 . The method according to  claim 6 , wherein based on the total weight of the ceramic composition, the amount of the ceramic powder is 90 wt % to 99.998 wt %, and the amount of the functional powder is 0.002 wt % to 10 wt %. 
     
     
         8 . The method according to  claim 7 , wherein based on the total weight of the ceramic composition, the amount of the ceramic powder is 98 wt % to 99.995 wt %, and the amount of the functional powder is 0.005 wt % to 2 wt %. 
     
     
         9 . The method according to  claim 1 , wherein when the functional powder is a simple substance of M, and the ceramic composition is sintered under an atmosphere of air or oxygen. 
     
     
         10 . The method according to  claim 1 , wherein the radiating uses an energy beam, which is at least one selected from a group consisting of a laser beam, an electron beam, and an ion beam. 
     
     
         11 . The method according to  claim 10 , wherein the laser radiation conditions comprise a wavelength of 200 nm to 3000 nm, a power of 5 W to 3000 W, a frequency of 0.1 KHz to 200 KHz, a linear velocity of 0.01 mm/s to 50000 mm/s, and a fill spacing of 0.01 mm to 5 mm. 
     
     
         12 . The method according to  claim 10 , wherein the energy of the ion beam is 10 1  eV to 10 6  eV. 
     
     
         13 . The method according to  claim 10 , wherein the power density of the electron beam is 10 1 W/cm 2  to 10 11 W/cm 2 . 
     
     
         14 . The method according to  claim 1 , wherein M is different from E. 
     
     
         15 . A ceramic product, comprising:
 a ceramic substrate; and   a metal layer formed on a predetermined region of a surface of the ceramic substrate,   wherein the ceramic substrate comprises a ceramic body and a functional aid dispersed in the ceramic body; the ceramic body is at least one selected from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E; E is at least one selected from a group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, B, Al, Ga, Si, Ge, P, As, Sc, Y, Zr, Hf, and lanthanide elements; the functional aid is at least one selected from a group consisting of a composite oxide of M and E, a composite nitride of M and E, a composite oxynitride of M and E, and a composite carbide of M and E; and M is at least one selected from a group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, In, Sn, Sb, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu.   
     
     
         16 . The ceramic product according to  claim 15 , wherein M is different from E. 
     
     
         17 . The ceramic product according to  claim 15 , wherein based on the total weight of the functional aid, the amount of M is 0.01 wt % to 99.99 wt %, and the amount of E is 0.01 wt % to 99.99 wt %. 
     
     
         18 . The ceramic product according to  claim 17 , wherein the thickness of the predetermined region of the surface of the ceramic substrate is 0.01-500 microns smaller than that of other regions of the surface of the ceramic substrate. 
     
     
         19 . The ceramic product according to  claim 17 , wherein the metal layer has a one-dimensional, two-dimensional, or three-dimensional structure. 
     
     
         20 . (canceled)