Heat sink for use in an electronics system

Abstract

A heat sink for use in a computer system may include a first heat sink body including a first plurality of heat dissipation structures; a second heat sink body including a second plurality of heat dissipation structures, the second heat sink body being physically spaced apart from the first heat sink body; and a heat pipe having a first portion coupled to the first heat sink body, a second portion coupled to the second heat sink body, and a third portion extending between the first and second heat sink bodies such that the heat pipe provides a physical coupling between the spaced apart first and second heat sink bodies.

What is claimed is: 
     
         1 . A heat sink for use in a computer system, comprising:
 a first heat sink body including a first plurality of heat dissipation structures;   a second heat sink body including a second plurality of heat dissipation structures, the second heat sink body being physically spaced apart from the first heat sink body; and   a heat pipe having a first portion coupled to the first heat sink body, a second portion coupled to the second heat sink body, and a third portion extending between the first and second heat sink bodies such that the heat pipe provides a physical coupling between the spaced apart first and second heat sink bodies.   
     
     
         2 . The heat sink of  claim 1 , wherein the at least one of the first plurality of heat dissipation structures and the second plurality of heat dissipation structures comprises an array of fins. 
     
     
         3 . The heat sink of  claim 1 , wherein the at least one of the first plurality of heat dissipation structures and the second plurality of heat dissipation structures comprises an array of post-shaped structures. 
     
     
         4 . The heat sink of  claim 1 , wherein the first heat sink body and the second heat sink body have substantially different shapes. 
     
     
         5 . The heat sink of  claim 1 , wherein the heat pipe comprises a substantially U-shaped body. 
     
     
         6 . The heat sink of  claim 1 , further comprising an additional heat pipe coupled to the first heat sink body but not to the second heat sink body. 
     
     
         7 . The heat sink of  claim 6 , wherein each of the heat pipe and the additional heat pipe comprises a substantially U-shaped body. 
     
     
         8 . The heat sink of  claim 7 , wherein the substantially U-shaped body of the heat pipe is arranged perpendicular to the substantially U-shaped body of the additional heat pipe. 
     
     
         9 . The heat sink of  claim 7 , wherein:
 the first heat sink body is generally U-shaped; and   the U-shaped body of the additional heat pipe corresponds generally with the U-shaped first heat sink body.   
     
     
         10 . The heat sink of  claim 6 , wherein each of the heat pipe and the additional heat pipe passes through an interface area of the first heat sink body, the interface area configured for physically interfacing with a heat-generating electrical component, such that both heat pipes are arranged to receive heat from the heat-generating electrical component. 
     
     
         11 . The heat sink of  claim 6 , wherein the first heat sink body is substantially larger than the second heat sink body. 
     
     
         12 . The heat sink of  claim 1 , wherein:
 the first portion of the heat pipe is positioned within a channel formed in the first heat sink body such that an outer surface of the first portion of the heat pipe is flush with an outer surface of the first heat sink body; and   the second portion of the heat pipe is positioned within a channel formed in the second heat sink body such that an outer surface of the second portion of the heat pipe is flush with an outer surface of the second heat sink body.   
     
     
         13 . A heat management system, comprising:
 a multi-body heat sink comprising:
 a first heat sink body including a first plurality of heat dissipation structures; 
 a second heat sink body including a second plurality of heat dissipation structures, the second heat sink body being physically spaced apart from the first heat sink body; and 
 a thermally conductive coupling structure extending between the first and second heat sink bodies to provide a physical coupling between the spaced apart first and second heat sink bodies; and 
   a first heat-generating electrical component arranged adjacent the first heat sink body such that the multi-body heat sink is configured to receive heat generated by the first heat-generating electrical component at the first heat sink body, transfer at least a portion of the received heat to the spaced apart second heat sink body via the thermally conductive coupling structure, and dissipate at least a portion of the transferred heat via convection through the second plurality of heat dissipation structures of the second heat sink body.   
     
     
         14 . The heat management system of  claim 13 , further comprising a second heat-generating electrical component arranged between the first and second heat sink bodies. 
     
     
         15 . The heat management system of  claim 14 , wherein:
 the second heat-generating electrical component arranged between the first and second heat sink bodies comprises at least one elongated memory device extending in a first direction; and   each the first plurality of heat dissipation structures and the second plurality of heat dissipation structures comprises an array of fins that extend in the first direction;   such that the second heat-generating electrical component, the first plurality of heat dissipation structures, and the second plurality of heat dissipation structures are all configured to direct an air flow in the same first direction.   
     
     
         16 . The heat management system of  claim 13 , wherein the thermally conductive coupling structure comprises a heat pipe extending between the first and second heat sink bodies to provide the physical coupling between the first and second heat sink bodies. 
     
     
         17 . The heat management system of  claim 13 , wherein the first heat sink body is substantially larger than the second heat sink body. 
     
     
         18 . The heat management system of  claim 16 , wherein the heat pipe comprises a first portion coupled to the first heat sink body, a second portion coupled to the second heat sink body, and a third portion extending between the first and second heat sink bodies to provide the physical coupling between the first and second heat sink bodies.