Z-directed printed circuit board components having a removable end portion and methods therefor

Abstract

A Z-directed component for mounting in a mounting hole in a printed circuit board according to one example embodiment includes a main body portion and a tapered end portion that facilitates insertion of the Z-directed component into the mounting hole in the printed circuit board. The tapered end portion is removably attached to the main body portion such that the tapered end portion may be removed after the Z-directed component is inserted into the mounting hole in the printed circuit board. A method for installing a Z-directed component having a removable tapered lead-in into the mounting hole according to one example embodiment includes inserting the Z-directed component into the mounting hole in the printed circuit board with the removable tapered lead-in leading the insertion and after the Z-directed component is inserted into the mounting hole, removing the removable lead-in from the rest of the Z-directed component.

What is claimed is: 
     
         1 . A Z-directed component for mounting in a mounting hole in a printed circuit board, comprising:
 a main body portion; and   a tapered end portion that facilitates insertion of the Z-directed component into the mounting hole in the printed circuit board, the tapered end portion being removably attached to the main body portion such that the tapered end portion may be removed after the Z-directed component is inserted into the mounting hole in the printed circuit board.   
     
     
         2 . The Z-directed component of  claim 1 , further comprising at least one breakable connector connecting the main body portion to the tapered end portion. 
     
     
         3 . The Z-directed component of  claim 2 , further comprising a gap formed between the main body portion and the tapered end portion, the at least one breakable connector bridging the gap. 
     
     
         4 . The Z-directed component of  claim 2 , wherein the tapered end portion is removable from the main body portion by twisting the tapered end portion to sever the at least one breakable connector. 
     
     
         5 . The Z-directed component of  claim 2 , wherein the main body portion, the tapered end portion and the at least one breakable connector are formed integrally with each other. 
     
     
         6 . The Z-directed component of  claim 1 , further comprising an engagement feature positioned on an end surface of the tapered end portion, the engagement feature being keyed to engage a tool for removing the tapered end portion after the Z-directed component is inserted into the mounting hole in the printed circuit board. 
     
     
         7 . The Z-directed component of  claim 6 , wherein the engagement feature includes an indentation formed in the end surface of the tapered end portion. 
     
     
         8 . The Z-directed component of  claim 1 , wherein the main body portion includes a channel formed in a side surface of the main body portion. 
     
     
         9 . The Z-directed component of  claim 1 , wherein the main body portion includes a conductive channel that extends along the length of an interior portion of the main body portion. 
     
     
         10 . A method for installing a Z-directed component having a removable tapered lead-in into a mounting hole in a printed circuit board, comprising:
 inserting the Z-directed component into the mounting hole in the printed circuit board with the removable tapered lead-in leading the insertion; and   after the Z-directed component is inserted into the mounting hole, removing the removable lead-in from the rest of the Z-directed component.   
     
     
         11 . The method of  claim 10 , wherein removing the removable tapered lead-in from the Z-directed component includes severing a connector between the removable tapered lead-in and the rest of the Z-directed component. 
     
     
         12 . The method of  claim 11 , wherein the connector is severed by twisting the removable tapered lead-in relative to the rest of the Z-directed component. 
     
     
         13 . The method of  claim 12 , wherein the removable tapered lead-in is twisted by a tool that engages with an engagement feature on an end surface of the removable tapered lead-in. 
     
     
         14 . A method for forming a Z-directed component for insertion into a mounting hole in a printed circuit board, comprising:
 filling a first cavity having a tapered surface with a body material to form a tapered end portion of the Z-directed component;   providing a first layer of a constraining material on top of the first cavity, the first layer of the constraining material having a second cavity having a width that is smaller than a width of the first cavity;   filling the second cavity with the body material;   providing successive layers of the constraining material on top of the first layer of the constraining material, each of the successive layers of the constraining material having a cavity defining the outer shape of a corresponding layer of a main body portion of the Z-directed component;   selectively filling the cavities of the successive layers of the constraining material with at least the body material to form the layers of the main body portion of the Z-directed component;   dissipating the constraining material to release the Z-directed component from the constraining material; and   firing the Z-directed component.   
     
     
         15 . The method of  claim 14 , wherein the first cavity includes a protrusion on a bottom surface thereof that forms a corresponding indentation in an end surface of the tapered end portion of the Z-directed component for engaging a tool for removing the tapered end portion after the Z-directed component is inserted into the mounting hole in the printed circuit board. 
     
     
         16 . The method of  claim 14 , wherein the first cavity is formed in a substrate that supports the layers of the constraining material. 
     
     
         17 . The method of  claim 14 , wherein the first cavity is formed in a release layer coated on a substrate that supports the layers of the constraining material. 
     
     
         18 . The method of  claim 17 , wherein the first cavity is formed in the release layer by gray scale lithography.