Electro copper plating additive and electro copper plating bath

Abstract

Provided are an additive for electro copper plating and an electro copper plating bath containing the additive, wherein the additive forms a plating film uniformly in a range of from a low current density portion to a high current density portion and thereby gives good glossiness, and is not consumed at the time of non-usage thereof. In the present invention, an additive for electro copper plating including a block polymer compound expressed by the following general formula (1) is added to an electro copper plating bath. (Here, in the formula, R represents an alkyl group or an alkenyl group having a linear-chain or branched-chain structure and having a carbon number of 1 to 15, m is an integer of from 1 to 30, and n is an integer of from 1 to 40.)

1 . An additive for electro copper plating, comprising a block polymer compound expressed by a following general formula (1): 
       
         
           
           
               
               
           
         
         wherein R represents an alkyl group or an alkenyl group having a linear-chain or branched-chain structure and having a carbon number 1 to 15, m is an integer of from 1 to 30, and n is an integer of from 1 to 40. 
       
     
     
         2 . The additive for electro copper plating according to  claim 1 , wherein the block polymer compound is obtained in such a manner that, under an atmosphere of inert gas, an alkyl alcohol or an alkenyl alcohol having a carbon number of 1 to 15 is made to undergo an addition reaction with propylene oxide, and then ethylene oxide is added and reacted. 
     
     
         3 . An electro copper plating bath containing the additive for electro copper plating according to  claim 1 .