Abrasive Article for Lower Speed Grinding Operations

Abstract

An abrasive article includes a bonded abrasive body having abrasive particles contained within a bond material. The bonded abrasive body may include an abrasive particle-to-bond material interfacial modulus of elasticity (MOE) of at least about 225 GPa. The bonded abrasive body may be configured to grind a workpiece comprising metal at a speed of less than about 60 m/s.

1 . An abrasive article comprising:
 a bonded abrasive body having abrasive particles contained within a bond material, the bonded abrasive body comprises an abrasive particle-to-bond material interfacial modulus of elasticity (MOE) of at least about 225 GPa; and   the bonded abrasive body is configured to grind a workpiece comprising metal at a speed of less than about 60 m/s.   
     
     
         2 .- 3 . (canceled) 
     
     
         4 . The abrasive article of  claim 1 , wherein the bonded abrasive body comprises an abrasive particle-to-bond material interfacial hardness of at least about 13 GPa. 
     
     
         5 .- 6 . (canceled) 
     
     
         7 . The abrasive article of  claim 1 , wherein the bonded abrasive body comprises a surface finish of not greater than about 125 micro-inch at an in-feed rate (Z′w) of not greater than about 1.4 inches/min. 
     
     
         8 . The abrasive article of  claim 1 , wherein the bonded abrasive body comprises a material removal rate of at least about 0.235 in 3 /min at an in-feed rate (Z′w) of not greater than about 1.8 inches/min. 
     
     
         9 . The abrasive article of  claim 1 , wherein the bonded abrasive body comprises an x-axis corner holding factor of not greater than about 0.080 inches at an in-feed rate (Z′w) of 1.8 inches/min, not greater than about 0.070 inches, not greater than about 0.060 inches, not greater than about 0.050 inches, not greater than about 0.042 inches. 
     
     
         10 . The abrasive article of  claim 1 , wherein the bonded abrasive body comprises a y-axis corner holding factor of not greater than about 0.033 inches at an in-feed rate (Z′w) of 1.8 inches/min, not greater than about 0.030 inches, not greater than about 0.025 inches, not greater than about 0.024 inches. 
     
     
         11 .- 13 . (canceled) 
     
     
         14 . The abrasive article of  claim 1 , wherein the bonded abrasive body is configured to grind a workpiece comprising metal at a speed of at least about 35 m/s. 
     
     
         15 .- 16 . (canceled) 
     
     
         17 . The abrasive article of  claim 1 , wherein the bonded abrasive body comprises a porosity of at least about 42 vol % to about 70 vol % of a total volume of the bonded abrasive body, and the bonded abrasive body comprises at least about 35 vol % abrasive particles of the total volume of the bonded abrasive body. 
     
     
         18 .- 33 . (canceled) 
     
     
         34 . The abrasive article of  claim 1 , wherein the bond material is formed from at least one alkali oxide compound (R 2 O) and at least one alkaline earth oxide compound (RO), wherein a total content of the alkali oxide compound and the alkaline earth oxide compound is not greater than about 20 wt %. 
     
     
         35 .- 38 . (canceled) 
     
     
         39 . The abrasive article of  claim 1 , wherein the bonded abrasive body is sintered at a temperature of not greater than about 1000° C. 
     
     
         40 .- 42 . (canceled) 
     
     
         43 . The abrasive article of  claim 1 , wherein the bond material comprises a ratio of weight percent silicon oxide (SiO 2 ) to weight percent Li 2 O (SiO 2 :Li 2 O) of about 9.6 to about 26. 
     
     
         44 . The abrasive article of  claim 1 , wherein the bond material comprises a ratio of weight percent silicon oxide (SiO 2 ) to weight percent Na 2 O(SiO 2 :Na 2 O) of about 4.8 to about 10.4. 
     
     
         45 . The abrasive article of  claim 1 , wherein the bond material comprises a ratio of weight percent silicon oxide (SiO 2 ) to weight percent K 2 O(SiO 2 :K 2 O) of about 9.6 to about 26. 
     
     
         46 . The abrasive article of  claim 1 , wherein the bond material comprises a ratio of weight percent silicon oxide (SiO 2 ) to weight percent B 2 O 3  (SiO 2 :B 2 O 3 ) of about 2.8 to about 5.2. 
     
     
         47 .- 55 . (canceled) 
     
     
         56 . The abrasive article of  claim 1 , wherein the bond material comprises a ratio of weight percent Li 2 O to weight percent Na 2 O (Li 2 O:Na 2 O) of about 0.2 to about 1. 
     
     
         57 . The abrasive article of  claim 1 , wherein the bond material comprises a ratio of weight percent Li 2 O to weight percent K 2 O (Li 2 O:K 2 O) of about 0.4 to about 2.5. 
     
     
         58 . (canceled) 
     
     
         59 . The abrasive article of  claim 1 , wherein the bond material comprises a ratio of weight percent Na 2 O to weight percent K 2 O (Na 2 O:K 2 O) of about 1 to about 5. 
     
     
         60 .- 62 . (canceled) 
     
     
         63 . The abrasive article
 of  claim 1 , wherein the bonded abrasive body comprises a grinding factor defined as a change of x-axis radius over a change in in-feed rate, and the grinding factor is not greater than about 0.040 for an in-feed rate (Z′w) of at least about 1.0 inches/min.   
     
     
         64 .- 65 . (canceled) 
     
     
         66 . An abrasive article comprising:
 a bonded abrasive body having abrasive particles contained within a bond material;   the bonded abrasive body comprises a grinding factor defined as a change of y-axis radius over a change in in-feed rate, and the grinding factor is not greater than about 0.018 for an in-feed rate (Z′w) of at least about 1.0 inches/min; and   the bonded abrasive body is configured to grind a workpiece comprising metal at a speed of less than about 60 m/s.   
     
     
         67 .- 68 . (canceled) 
     
     
         69 . An abrasive article comprising:
 a bonded abrasive body having abrasive particles contained within a bond material formed from not greater than about 20 wt % boron oxide (B 2 O 3 ), having a ratio of weight percent silica (SiO 2 ): weight percent alumina (Al 2 O 3 ) of not greater than about 3.2 (by weight percent) and not greater than about 3.0 wt % phosphorous oxide (P 2 O 5 ), wherein the bonded abrasive body has a porosity of at least about 42 vol % of the total volume of the bonded abrasive body; and   the bonded abrasive body is capable of grinding a workpiece comprising metal at a speed of less than about 60 m/s.   
     
     
         70 .- 76 . (canceled)