US2014008057A1PendingUtilityA1

High frequency surface treatment methods and apparatus to extend downhole tool survivability

Assignee: SCHLUMBERGER TECHNOLOGY CORPPriority: May 6, 2010Filed: Sep 10, 2013Published: Jan 9, 2014
Est. expiryMay 6, 2030(~3.8 yrs left)· nominal 20-yr term from priority
C21D 1/613E21B 17/20E21B 17/16C21D 9/14E21B 43/116C21D 7/06E21B 17/1085
63
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Claims

Abstract

A downhole device with compressive layer at the surface thereof. Such devices may be particularly well suited for survivability in the face of potentially long term exposure to a downhole environment. Techniques for forming protective compressive layers at the surfaces of such devices may include positioning devices within a chamber for bombardment by high frequency particles. As a manner of enhancing the compressive layer thickness and effectiveness, low temperature conditions may be applied to the device during the high frequency treatment.

Claims

exact text as granted — not AI-modified
We claim: 
     
         1 . A device configured for use in a hydrocarbon well and having a cryogenically formed compressive layer of high frequency particles at a surface thereof for enhancing survivability in a downhole environment. 
     
     
         2 . The device of  claim 1  wherein the surface comprises one of a precipitation hardening metal, a nickel based alloy and stainless steel. 
     
     
         3 . The device of  claim 1  configured as one of a tubular, wireline, slickline, a drill collar, a testing device, and a perforating gun. 
     
     
         4 . The device of  claim 3  wherein the tubular is one of coiled tubing and production tubing. 
     
     
         5 . The device of  claim 1  wherein the compressive layer enhances one of strength and load bearing capacity for the device. 
     
     
         6 . The device of  claim 1  wherein the compressive layer enhances resistance to one of corrosion, cracking, galling, wear, and contact fatigue for the device. 
     
     
         7 . The device of  claim 1  wherein the layer is of a thickness greater than about 250 microns.

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