Method of manufacturing heat-dissipating device without injection tube and object manufactured by the method

Abstract

A method of manufacturing a heat-dissipating device without injection tube and an object manufactured by the method. The method includes the steps of: a) providing an upper casing and a lower casing, wherein a receiving space is defined between the upper casing and the lower casing; b) positioning a capillary and a brace in the receiving space, welding the upper casing and the lower casing in a manner to seal a seam therebetween hermetically, and reserving a crevice; c) sintering; d) injecting a liquid working medium from the crevice into the receiving space; and e) putting the combination of the upper casing and the lower casing into which the liquid working medium has been injected in step d) in a vacuum environment and welding the crevice quickly to seal the crevice hermetically. An exposed heat-dissipating device without injection tube effective in dissipating heat is manufactured by the method.

What is claimed is:  
     
         1 . A method of manufacturing a heat-dissipating device without injection tube, the method comprising the steps of:
 a) providing an upper casing and a lower casing, wherein a receiving space is defined between the upper casing and the lower casing;   b) positioning a capillary and a brace in the receiving space, welding the upper casing and the lower casing in a manner to seal a seam therebetween hermetically, and reserving a crevice, wherein the capillary comprises an upper portion and a lower portion, and the brace is positioned between the upper portion and the lower portion to support and space apart the upper portion and the lower portion;   c) sintering a combination of the upper casing and the lower casing welded together in step b);   d) injecting a liquid working medium from the crevice into the receiving space, wherein the liquid working medium thus injected is of predetermined quantity; and   e) putting a combination of the upper casing and the lower casing into which the liquid working medium has been injected in step d) in a vacuum environment and welding the crevice quickly to seal the crevice hermetically.   
     
     
         2 . The method of  claim 1 , wherein an upper wick is disposed on a bottom surface of the upper casing, and a lower wick is disposed on a top surface of the lower casing. 
     
     
         3 . The method of  claim 2 , wherein the upper wick and the lower wick are one of a plurality of grooves, a sintered copper powder, and a metallic mesh. 
     
     
         4 . The method of  claim 1 , wherein, in step e), the upper casing and the lower casing are clamped together with a clamp before step e) is performed. 
     
     
         5 . The method of  claim 1 , wherein, in step e), the crevice is hermetically sealed by high-energy welding. 
     
     
         6 . The method of  claim 5 , wherein the high-energy welding is one of electronic-beam welding, high-frequency argon arc welding, and laser welding. 
     
     
         7 . The method of  claim 1 , wherein, in step b), the capillary is one of a metallic mesh and a sintered copper powder. 
     
     
         8 . The method of  claim 1 , wherein, in step b), the brace is one of a net frame and a plurality of supporting posts. 
     
     
         9 . The method of  claim 1 , wherein the upper portion is in contact with a bottom surface of the upper casing, and the lower portion is in contact with a top surface of the lower casing. 
     
     
         10 . The method of  claim 1 , wherein step b) further involves positioning an upper auxiliary capillary between the capillary and the upper casing and positioning a lower auxiliary capillary between the capillary and the lower casing while positioning a capillary and a brace in the receiving space. 
     
     
         11 . The method of  claim 10 , wherein the upper auxiliary capillary and the lower auxiliary capillary are one of a metallic mesh and a sintered copper powder. 
     
     
         12 . An heat-dissipating device manufactured by the method of  claim 1 , comprising:
 an upper casing and a lower casing, wherein a receiving space is defined therebetween;   a capillary disposed in the receiving space and comprising an upper portion and a lower portion;   a brace disposed in the receiving space, positioned between the upper portion and the lower portion, and adapted to space apart the upper portion and the lower portion;   a liquid working medium disposed in the receiving space and being of predetermined quantity,   wherein the capillary and the brace are sintered to thereby be coupled to the upper casing and the lower casing; and   a crevice formed by welding a seam between the upper and lower casings and sealed hermetically by high-energy welding.   
     
     
         13 . The heat-dissipating device of  claim 12 , wherein the high-energy welding is one of electronic-beam welding, high-frequency argon arc welding, and laser welding. 
     
     
         14 . The heat-dissipating device of  claim 12 , wherein the capillary is one of a metallic mesh and a sintered copper powder. 
     
     
         15 . The heat-dissipating device of  claim 12 , wherein the brace is one of a net frame and a plurality of supporting posts. 
     
     
         16 . The heat-dissipating device of  claim 12 , wherein an upper wick is disposed on a bottom surface of the upper casing, and a lower wick is disposed on a top surface of the lower casing. 
     
     
         17 . The heat-dissipating device of  claim 16 , wherein the upper wick and the lower wick are one of a plurality of grooves, a sintered copper powder, and a metallic mesh. 
     
     
         18 . The heat-dissipating device of  claim 12 , wherein the upper portion is in contact with a bottom surface of the upper casing, and the lower portion is in contact with a top surface of the lower casing. 
     
     
         19 . The heat-dissipating device of  claim 12 , wherein an upper auxiliary capillary is disposed between the capillary and the upper casing, and a lower auxiliary capillary is disposed between the capillary and the lower casing. 
     
     
         20 . The heat-dissipating device of  claim 19 , wherein the upper auxiliary capillary and the lower auxiliary capillary are one of a metallic mesh and a sintered copper powder.