US2014014308A1PendingUtilityA1
Heat Sink and Electronic Device and Heat Exchanger Applying the Same
Est. expiryJul 13, 2032(~6 yrs left)· nominal 20-yr term from priority
H05K 7/20409F28F 2215/04F28F 3/02
44
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Claims
Abstract
A heat sink includes a substrate, at least a first fin set and at least a second fin set. The first fin set is disposed on the substrate and has a plurality of first fins, and the first fin has a plurality of first holes. The second fin set is disposed on the substrate and has a plurality of second fins, and the second fin has a plurality of second holes. The total area of the second holes is larger than that of the first holes. An electronic device and a heat exchanger which are configured with the heat sink are also disclosed. The structure and configuration of the heat fins can increase the wind guiding effect, and thus improve the heat-dissipation efficiency.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A heat sink, comprising:
a substrate; a first fin set disposed on the substrate and having a plurality of first fins, wherein each of the first fins has a plurality of first holes; and a second fin set disposed on the substrate and located adjacent to the first fin set, wherein the second fin set has a plurality of second fins, and each of the second fins has a plurality of second holes; wherein, the total area of the second holes is larger than that of the first holes.
2 . The heat sink of claim 1 , wherein the first fin set is disposed adjacent to an outlet, and at least a fan is configured at the outlet.
3 . The heat sink of claim 2 , wherein the heat sink is disposed in a casing having a first inlet, the second fin set is disposed adjacent to the first inlet, and the second holes are opposite to the first inlet.
4 . The heat sink of claim 3 , wherein the casing further has at least a second inlet, and the second inlet is opposite to at least a part of the first fins and the second fins.
5 . The heat sink of claim 3 , wherein the casing further has at least a side plate disposed at one side of the substrate and located adjacent to the outlet.
6 . The heat sink of claim 1 , further comprising:
a third fin set disposed on the substrate and located between the first fin set and the second fin set, wherein the third fin set has a plurality of third fins, each of the third fins has a plurality of third holes, and the total area of the third holes is between those of the first holes and the second holes.
7 . An electronic device, comprising:
a first casing; a heat sink configured at one side of the first casing and comprising:
a substrate, wherein the substrate and the first casing form an accommodating space,
a first fin set disposed on the substrate and having a plurality of first fins, wherein each of the first fins has a plurality of first holes, and
a second fin set disposed on the substrate and located adjacent to the first fin set, wherein the second fin set has a plurality of second fins, and each of the second fins has a plurality of second holes; and
an electronic element disposed in the accommodating space; wherein, the total area of the second holes is larger than that of the first holes.
8 . The electronic device of claim 7 , wherein the first fin set is disposed adjacent to an outlet, and at least a fan is configured at the outlet.
9 . The electronic device of claim 8 , wherein the heat sink is disposed in a second casing having a first inlet, the second fin set is disposed adjacent to the first inlet, and the second holes are opposite to the first inlet.
10 . The electronic device of claim 9 , wherein the second casing further has at least a second inlet, and the second inlet is opposite to at least a part of the first fins and the second fins.
11 . The electronic device of claim 9 , wherein the second casing further has at least a side plate disposed at one side of the substrate and located adjacent to the outlet.
12 . The electronic device of claim 7 , wherein the heat sink further comprises:
a third fin set disposed on the substrate and located between the first fin set and the second fin set, wherein the third fin set has a plurality of third fins, each of the third fins has a plurality of third holes, and the total area of the third holes is between those of the first holes and the second holes.
13 . A heat exchanger, comprising:
a heat sink comprising:
a substrate,
a first fin set disposed on the substrate and having a plurality of first fins, wherein each of the first fins has a plurality of first holes, and
a second fin set disposed on the substrate and having a plurality of second fins, wherein each of the second fins has a plurality of second holes; and
a heat absorber disposed at one side of the substrate opposite to the heat sink; wherein, the total area of the second holes is larger than that of the first holes.
14 . The heat exchanger of claim 13 , wherein the first fin set is disposed adjacent to an outlet, and at least a fan is configured at the outlet.
15 . The heat exchanger of claim 14 , wherein the heat sink is disposed in a casing having a first inlet, the second fin set is disposed adjacent to the first inlet, and the second holes are opposite to the first inlet.
16 . The heat exchanger of claim 15 , wherein the casing further has at least a second inlet, and the second inlet is opposite to at least a part of the first fins and the second fins.
17 . The heat exchanger of claim 15 , wherein the casing further has at least a side plate disposed at one side of the substrate and located adjacent to the outlet.
18 . The heat exchanger of claim 13 , wherein the heat sink further comprises:
a third fin set disposed on the substrate and located between the first fin set and the second fin set, wherein the third fin set has a plurality of third fins, each of the third fins has a plurality of third holes, and the total area of the third holes is between those of the first holes and the second holes.Cited by (0)
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