Scalable led-uv module

Abstract

An LED-UV lamp that is easily interchangeable within a UV-curing process and scalable in length with a fine resolution so that it is easily customizable to any UV-curing application. The LED-UV lamp may incorporate multiple rows of LEDs and contain corresponding optics that effectively deliver radiant power to a substrate at distances of several inches.

1 - 20 . (canceled) 
     
     
         21 . A UV LED lamp, comprising:
 a connection end cap with electrical and fluid connections and alignment pins;   a cross over end cap; and   a lamp body disposed between said connection end cap and said cross over end cap and having a first plurality of LEDs emitting UV radiation, a first reflector positioned to reflect and focus UV radiation from said first plurality of LEDs onto a substrate, and a heat sink to absorb heat generated by said LEDs.   
     
     
         22 . The UV LED lamp of  claim 21 , further comprising a second plurality of LEDs and a second reflector positioned to reflect and focus UV radiation from said second plurality of LEDs onto said substrate. 
     
     
         23 . A UV LED lamp, comprising:
 a pair of end caps;   a heat sink mounted between said end caps;   a LED segment with a first plurality of LED subassembly packages, said LED segment having a thermal interface material, said LED subassembly packages contacting said thermal interface material; and   a first reflector positioned to reflect and focus radiation from the LED subassembly packages onto a substrate,   wherein said first plurality of LED subassembly packages is varied in number to accommodate a variable width or length of said substrate.   
     
     
         24 . The UV LED lamp of  claim 23 , further comprising another LED segment and a second reflector, said other LED segment with a second plurality of LED subassembly packages mounted to a second surface of said heat sink,
 wherein said second plurality of LED subassembly packages is varied in number to accommodate said variable width or length of said substrate, said second reflector positioned to reflect and focus radiation from the LED subassembly packages onto said substrate.   
     
     
         25 . The UV LED lamp of  claim 24 , wherein said second plurality of LED subassembly segments emits a radiation wavelength differing from a radiation wavelength of said first plurality of LED subassembly segments. 
     
     
         26 . The UV LED lamp of  claim 23 , further comprising a plurality of alignment pins extending from one of said end caps. 
     
     
         27 . The UV LED lamp of  claim 23 , further comprising a pair of fluid valves for admitting coolant to ingress and egress said heat sink. 
     
     
         28 . The UV LED of  claim 27 , wherein said heat sink defines a pair of coolant passages, wherein one of said coolant passages admits coolant ingressing said heat sink and wherein the other of said coolant passages admits coolant egressing said heat sink. 
     
     
         29 . The UV LED of  claim 28 , wherein each of said coolant passages is bounded by fin features protruding into said liquid coolant. 
     
     
         30 . A method of configuring a UV LED lamp for UV-curing of a substrate surface, said method comprising:
 selecting a first plurality of LED subassembly segments to accommodate a length or a width of said substrate surface; and   placing said plurality of selected LED subassembly segments within said UV LED lamp.   
     
     
         31 . The method of  claim 30 , further comprising:
 selecting a second plurality of LED subassembly segments to accommodate said length or said width of said substrate surface; and   placing said plurality of selected LED subassembly segments within said UV LED lamp.   
     
     
         32 . The method of  claim 30 , further comprising positioning a reflector to reflect UV radiation emitted from said LED subassembly segments to said substrate surface. 
     
     
         33 . The method of  claim 32 , wherein said LED subassembly segments are attached to a heat sink having a pair of coolant passages. 
     
     
         34 . The method of  claim 32 , further comprising disposing said reflector and LED subassembly segments between a pair of end caps. 
     
     
         35 . A method of curing materials deposited on a substrate, said materials having UV photoinitiators, such method comprising directing UV radiation at said substrate, said UV radiation originating from the UV LED lamp of  claim 21 . 
     
     
         36 . A method of curing materials deposited on a substrate, said materials having UV photoinitiators, such method comprising directing UV radiation at said substrate, said UV radiation originating from the UV LED lamp of  claim 23 . 
     
     
         37 . A method of curing materials deposited on a substrate, said materials having UV photoinitiators, such method comprising directing UV radiation at said substrate, said UV radiation originating from the UV LED lamp of  claim 24 . 
     
     
         38 . The method of  claim 37 , wherein a different material is cured by each of said subassemblies, such subassemblies emitting differing wavelengths of UV radiation. 
     
     
         39 . The method of  claim 37 , further comprising cooling said UV subassembly segments. 
     
     
         40 . The method of  claim 39 , wherein said UV subassembly segments are cooled by circulating coolant through a pair of coolant passages located in said heat sink.