Resin material, manufacturing method thereof, repairing method thereof, and various components using the same
Abstract
An application to a resin material and a polymerization method of a polymerization agent having a polymerizable surface structure and a mechanism of supplying the polymerization agent, the polymerization agent exhibiting a polymerizing function in contact with the surface of the resin material. The resin material is obtained by living radical polymerization of a radical polymerization initiator exhibiting living property and an unsaturated monomer capable of radical polymerization with the polymerization initiator. The polymerization agent is brought into in contact with the surface of the resin material to induce radical re-polymerization of the polymerization agent. As a result, a damaged portion of the resin material can be repaired or the resin materials can be bonded to each other by way of the polymerization agent, which can suppress formation of the hetero-interface or improve the service life of the resin material.
Claims
exact text as granted — not AI-modified1 . A resin material containing a resin formed by living radical polymerization of an unsaturated monomer polymerizable by a radical polymerization initiator, which is composed of boron-containing compound wherein
upon fracture of the resin material, the resin material has a self-repairing function in which, when sites capable of initiating radical polymerization are present at a fracture surface formed by the fracture and an unsaturated monomer capable of radical polymerization with the sites is brought into contact with the sites, radical polymerization of the unsaturated monomer to the sites is performed.
2 . The resin material according to claim 1 , comprising
vessels to encapsulate an unsaturated monomer capable of polymerization to the sites present at the fracture surface and capable of initiating radical polymerization, wherein the self-repairing function is provided such that when the vessels are destroyed upon fracture, the incorporated unsaturated monomer leaks out, and the leaked unsaturated monomer is brought into contact with the fracture surface, the unsaturated monomer in contact with the sites capable of initiating radical polymerization is subjected to radical polymerization.
3 . The resin material according to claim 1 , wherein
the radical polymerization initiator is an alkyl borane.
4 . The resin material according to claim 1 , wherein
the unsaturated monomer is one or more unsaturated monomers selected from the group consisting of aromatic vinyl compounds, alkyl(meth)acrylates, unsaturated monocarboxylic acid esters, fluoroalkyl(meth)acrylates, siloxanyl compounds, mono- or di-(meth)acrylates of alkylene glycols, alkoxyalkyl(meth)acrylates, cyanoalkyl(meth)acrylates, cyano compounds, oligo(meth)acrylates of polyhydric alcohols, hydroxyalkyl(meth)acrylates, hydroxyalkyl esters of unsaturated carboxylic acids, unsaturated alcohols, unsaturated (mono)carboxylic acids, unsaturated polycarboxylic acids or unsaturated polycarboxylic acid anhydrides, mono- or diesters of unsaturated polycarboxylic acids or unsaturated polycarboxylic acid anhydrides, epoxy group-containing unsaturated compounds, diene compounds, vinyl chloride, vinyl acetate, sodium isoprene sulfonate, cinnamic acid esters, crotonic acid esters, dicyclopentadiene, and ethylidene norbornene.
5 . The resin material according to claim 1 , wherein
the unsaturated monomer in contact with the sites is an unsaturated monomer which is identical with or different from the unsaturated monomer constituting the resin.
6 . The resin material according to claim 2 , wherein
the vessel has a particle shape, and the average particle diameter of the vessel is 10 nm or more and 1 mm or less.
7 . A method of manufacturing the resin material according to claim 2 , comprising:
a step of mixing the radical polymerization initiator, the unsaturated monomer constituting the resin, and the vessels to encapsulate the unsaturated monomer, and a step of performing living radical polymerization of the unsaturated monomer constituting the resin.
8 . A method of repairing the resin material according to claim 1 , wherein
the contact is performed by coating, injecting, dipping, spraying, printing, transferring, or bonding the unsaturated monomer capable of radical polymerization with the sites present at the fracture surface and capable of initiating radical polymerization.
9 . A method of repairing the resin material according to claim 2 , wherein
the vessel is burst upon fracture of the resin material, and the unsaturated monomer leaks out, and the leaked unsaturated monomer is brought into contact with the fracture surface, and thereby radical polymerization with the sites capable of initiating the radical polymerization is performed.
10 . The method of repairing the resin material according to claim 8 , wherein
the fracture surface is formed by damage, deformation, breakage, scratching, destruction, tearing, cutting, disconnection, deterioration, decomposition, molding, or film formation of the resin material.
11 . The method of repairing the resin material according to claim 8 , wherein
a reduction ratio of the strength of the resin material after repair is within 10% of the strength of the resin material before repair.
12 . The method of repairing the resin material according to claim 8 , wherein
a reduction ratio of a glass transition temperature of the resin material after repair measured by thermo-mechanical property analysis is within 10% of the glass transition temperature of the resin material before repair measured by thermo-mechanical property analysis.
13 . A cable coating material having the resin material according to claim 1 .
14 . A cable having the cable coating material according to claim 13 .
15 . A mold sealant having the resin material according to claim 1 .
16 . A mold sealing method using the mold sealant according to claim 15 .
17 . A potting material for manufacturing a mold sealant, which is used for manufacturing the mold sealant according to claim 15 .
18 . A package for electronic parts having the mold sealant according to claim 15 .
19 . A motor coil protective material having the resin material according to claim 1 .
20 . A varnish material for a motor coil protective material which is used for manufacturing the motor coil protective material according to claim 19 .
21 . A motor having the motor coil protective material according to claim 19 .
22 . A structural material having the resin material according to claim 1 .
23 . The structural material according to claim 22 , which is a casing material, a frame material, a panel material, or a model material.Cited by (0)
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