Method and device for manufacturing saw wire

Abstract

[Object] To provide a method and device for manufacturing an abrasive grain-fixed saw wire that realize homogeneous distribution of abrasive grains adhered to the outer surface of a wire while suppressing variations in the amount of abrasive grains adhered to the outer surface of the wire, even in a high-efficiency wire feeding mode with a high density of abrasive grains, back-and-forth running of the wire, and the like. [Constitution] The present invention includes: a plating tank 16 A that stores a plating solution M 1 containing abrasive grains D; a wire feeding means 2 that lets a wire W pass through the plating solution M 1; an electric current supply means 3 that supplies an electric current to the wire W and the plating solution M 1; an abrasive grain amount calculation means 4 that calculates the amount of abrasive grains D adhered to the outer surface of the wire W having passed through the plating solution M 1; and an electric current control means 5 that increases or decreases the value of an electric current flown into the wire W in the plating solution M 1 by the electric current supply means 3 according to the calculated amount of abrasive grains to control variations in the amount of the abrasive grains adhered to the outer surface of the wire so as to fall within a predetermined range.

1 . A method for manufacturing an abrasive grain-fixed saw wire by which a wire is passed through a plating solution containing abrasive grains to fix the abrasive grains to the outer periphery of the wire by electroplating, wherein the amount of the abrasive grains adhered to the outer surface of the wire having passed through the plating solution is calculated, and based on the calculated amount of the abrasive grains, the value of an electric current flown into the wire in the plating solution is increased or decreased to control variations in the amount of abrasive grains adhered to the outer surface of the wire so as to fall within a predetermined range. 
     
     
         2 . The method for manufacturing a saw wire according to  claim 1 , wherein, after forming the wire with the abrasive grains adhered to the outer surface by electroplating via a first plating layer, the wire is passed through a plating solution without abrasive grains to form a second plating layer on the outer surface by electroplating. 
     
     
         3 . The method for manufacturing a saw wire according to  claim 2 , wherein the first plating layer for adhering the abrasive grains to the outer surface of the wire is configured to be thinner than the second plating layer. 
     
     
         4 . The method for manufacturing a saw wire according to  claim 1 , wherein the outer surface of the wire having passed through the plating solution is imaged by a camera, and the amount of the abrasive grains is calculated based on image information in the taken image. 
     
     
         5 . The method for manufacturing a saw wire according to  claim 1 , wherein the wire is routed around a plurality of times between an out-solution rotary roller that is disposed outside the plating solution and supplied with an electric current by an electric current supply means and an in-solution rotary roller that is disposed in the plating solution, and the wire is run back and forth a plurality of times between inside and outside of the plating solution. 
     
     
         6 . The method for manufacturing a saw wire according to  claim 5 , wherein the wire is routed around at least two in-solution rotary rollers disposed in the plating solution. 
     
     
         7 . The method for manufacturing a saw wire according to  claim 5 , wherein a guide groove for guiding the wire a plurality of times in the direction of roller circumference, is provided on the outer peripheral surface of the out-solution rotary roller and/or the in-solution rotary roller. 
     
     
         8 . The method for manufacturing a saw wire according to  claim 1 , wherein the plating solution is stirred by a stirring means disposed in the plating solution. 
     
     
         9 . A device for manufacturing an abrasive grain-fixed saw wire that lets a wire pass through a plating solution containing abrasive grains to fix the abrasive grains to the outer periphery of the wire by electroplating, comprising:
 a plating tank that stores the plating solution containing the abrasive grains;   a wire feeding means that lets the wire pass through the plating solution;   an electric current supply means that supplies an electric current to the wire and the plating solution;   an abrasive grain amount calculation means that calculates the amount of abrasive grains adhered to the outer surface of the wire having passed through the plating solution; and   an electric current control means that increases or decreases the value of an electric current flown into the wire in the plating solution by the electric current supply means according to the amount of abrasive grains calculated by the abrasive grain amount calculation means to control variations in the amount of the abrasive grains adhered to the outer surface of the wire so as to fall within a predetermined range.   
     
     
         10 . The device for manufacturing a saw wire according to  claim 9 , wherein the abrasive grain amount calculation means includes a camera that images the outer surface of the wire having passed through the plating solution and a computing means that calculates the amount of the abrasive grains based on image information in an image taken by the camera. 
     
     
         11 . The device for manufacturing a saw wire according to  claim 9 , comprising an out-solution rotary roller that is disposed outside the plating solution and supplied with an electric current by the electric current supply means and an in-solution rotary roller that is disposed in the plating solution, wherein
 the wire is routed around a plurality of times between the out-solution rotary roller and the in-solution rotary roller and is run back and forth a plurality of times between inside and outside of the plating solution.