Optoelectronic Module Having a Carrier Substrate and a Plurality of Radiation-Emitting Semiconductor Components and Method for the Production Thereof

Abstract

An optoelectronic module is described including a carrier substrate and a plurality of radiation-emitting semiconductor components. The carrier substrate includes structured conductor tracks. The semiconductor components each include an active layer for generating electromagnetic radiation, a first contact area and a second contact area. The first contact area is in each case arranged on that side of the semiconductor components that is remote from the carrier substrate. The semiconductor components are provided with an electrically insulating layer having a cutout in a region of the first contact area. Conductive structures are arranged in regions on the insulating layer. One of the conductive structures electrically conductively connects at least the first contact area of a semiconductor component to a further first contact area of a further semiconductor component or to a conductor track of the carrier substrate. A method for producing such a module is also described.

What is claimed is: 
     
         1 . A method for producing an optoelectronic module comprising:
 arranging a plurality of radiation-emitting semiconductor components on a carrier substrate, wherein the carrier substrate has structured conductor tracks for making electrical contact with the radiation-emitting semiconductor components, the radiation-emitting semiconductor components each comprise an active layer suitable for generating electromagnetic radiation, a first contact area and a second contact area, and the first contact area is in each case arranged on that side of the radiation-emitting semiconductor components remote from the carrier substrate;   arranging a planarization layer at least between the radiation-emitting semiconductor components;   applying a first part of an electrically insulating layer to at least part of the radiation-emitting semiconductor components and a second part of the electrically insulating layer to at least part of the planarization layer, wherein the electrically insulating layer has a cutout in the region of the first contact area of the respective radiation-emitting semiconductor component; and   applying conductive structures to partial regions of the electrically insulating layer, wherein one of the conductive structures electrically conductively connects at least the first contact area of a radiation-emitting semiconductor component to another first contact area of another radiation-emitting semiconductor component or to a conductor track of the carrier substrate.   
     
     
         2 . The method according to  claim 1 , comprising applying the conductive structures by printing. 
     
     
         3 . The method according to  claim 1 , comprising applying the conductive structures by vapor deposition. 
     
     
         4 . The method according to  claim 1 , comprising forming the conductive structures by arranging an anisotropic layer on the electrically insulating layer in electrically conductive fashion at least in the region of the first contact area of the radiation-emitting semiconductor components. 
     
     
         5 . The method according to  claim 1 , wherein the conductive structures comprise electrically conductive webs, the method comprising electrically conductively applying the webs to the first contact area of a radiation-emitting semiconductor component by a stamping-wedge process.